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5295 Thermal Conductive Silicone Potting Compound 1:1 Mix UL94V-0

Categories Electronic Potting Compound
Brand Name: Huitian
Model Number: 5295
Certification: UL,SGS
Place of Origin: China
MOQ: 500 kg
Price: Negotiation
Supply Ability: 2000T/Month
Packaging Details: 10kg/bucket
Payment Terms: L/C,T/T
Delivery Time: 5-8 days
Material base: Silicone
Color: White
Mix Ratio: 1:1
Density: 1.65~1.75
Viscosity: 4,500~6,500
Operating time: 10~20 mins
Curing time (80℃): ≤30 mins
Hardness: 30~40 shore A
Work Temperature: -60~200℃
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5295 Thermal Conductive Silicone Potting Compound 1:1 Mix UL94V-0

5295 TDS-EN.pdf

Huitian 5295 is a cutting-edge two-part addition-type potting compound tailored for demanding electrical and electronic applications. Boasting a 1:1 mixing ratio for hassle-free handling, thermal conductivity to effectively manage heat, and UL94V-0 flame retardancy, it offers a robust solution to protect components from environmental hazards while ensuring efficient thermal management. Perfect for power-hungry devices, it strikes a balance between production efficiency and long-term performance, simplifying the manufacturing process and boosting product durability.


Product Applications

Huitian 5295 thrives in scenarios where heat dissipation, flame safety, and mechanical stability are of utmost importance:

  • PV Inverters: Seals power modules, enhancing thermal efficiency and shielding against dust and moisture.
  • LED Drivers: Encapsulates circuitry to control heat accumulation, thus prolonging the lifespan of LEDs.
  • Charging Piles (EV Chargers): Protects internal components from vibration, moisture, and high temperatures during rapid charging.
  • Automotive Electronics: Secures ECUs, sensors, and actuators, withstanding temperature variations and mechanical stress.
  • NEV Power & Controllers: Ensures thermal stability and flame resistance in new energy vehicle power systems, reducing fire risks.


Product Features

  1. Efficient Thermal Management
    Equipped with optimized thermal conductivity, it effectively prevents overheating and component failure in heat-intensive devices.
  2. UL94V - 0 Flame Retardancy
    It meets strict fire-safety standards, significantly reducing fire hazards in electrical systems.
  3. 1:1 Mixing Simplicity
    The equal-part mixing (by weight or volume) reduces measurement errors, speeding up production and ensuring consistent curing.
  4. Addition - Cure Technology
    This technology enables curing without by-products (such as alcohol or water), leading to low shrinkage and excellent dimensional stability, making it ideal for precision potting.
  5. Superior Electrical & Mechanical Properties
    With high electrical strength and insulation resistance, it protects against short circuits. The flexible cured matrix absorbs vibration and shock, improving long-term reliability.
  6. Wide Temperature Adaptability
    It performs reliably in extreme temperature conditions, matching the operating ranges of automotive and industrial electronics.

Product Specifications

ParameterDetails
ModelHuitian 5295
TypeTwo-part addition-type potting compound
Mixing Ratio1:1 (weight/volume)
Thermal Conductivity≥0.7 W/(m·K)
Flame RatingUL94V-0
Curing ConditionRoom temperature (25℃, 24h) or accelerated at 80℃/1h
Operating Temperature-40℃ to 125℃
Dielectric strength≥16 kV/mm (ASTM D149)
Volume Resistivity≥1×10¹⁵ Ω·cm (ASTM D257)

Packaging & Storage

  • Packaging: Available as separate containers of Part A and Part B (25kg + 25kg drums).
  • Storage: Store in a cool, dry place (0–35℃). Avoid direct sunlight and moisture.
  • Shelf Life: 12 months from the manufacturing date when stored unopened.
  • Handling: Seal containers after use to prevent moisture contamination, as addition - cure systems are sensitive to moisture.
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