Solar Inverter RIGID PCB Board
Multi Layer Printed Circuit Board Manufacturing for solar energy
applications
Product Specifications
| Layer Count | 4L |
| Material | FR-4 TG150 |
| Thickness | 2.5mm |
| Copper Thickness | 3.5oz |
| Dimension | 419 * 250mm |
| Surface Treatment | HASL LF |
| Application | Solar Inverter |
Product Images
About TECircuit
Founded: 2004
Location: Shenzhen, China - Electronics Manufacturing Service (EMS) provider
Services: Customizable EMS PCB offering comprehensive one-stop solutions
including PCB/PCBA, Flexible Printed Circuit Board (FPC),
Components Sourcing, Box-Building, and Testing
Quality Certifications: UL, ISO 9001, ISO 14001, ISO 13485, IATF 16949, compliant with
ROHS and REACH standards
Manufacturing Capacity: 50,000 sqm facility with 930+ employees and monthly production
capacity of 100,000 m²
Frequently Asked Questions
What is needed for a quotation?
PCB: Quantity, Gerber file, and technical requirements (material,
surface finish, copper thickness, board thickness)
PCBA: PCB information, BOM list, and testing documentation
What file formats do you accept for production?
PCB Gerber files, BOM lists for PCB assembly, and test methods for
PCBA
Are my files safe?
Your files are completely secure and protected. We safeguard
customer intellectual property throughout the entire process and
never share documents with third parties.
What is the shipment method?
We offer FedEx, DHL, TNT, and UPS shipping options.
Customer-provided shipment methods are also acceptable.
What is the payment method?
Telegraphic Transfer in advance (Advance T/T) and PayPal are
accepted.
Product Applications
- Grid-Tied Solar Inverters: Convert DC power from solar panels into AC power for grid
integration
- Off-Grid Solar Inverters: Power standalone systems in remote locations without grid access
- Battery-Based Systems: Integrated systems for solar energy storage and power supply
during non-sunny periods
- Microinverters: Small-scale installations converting DC to AC at panel level for
optimized energy harvest
- Power Optimizers: Module-level power management and conversion for maximum energy
output
- Hybrid Inverters: Combine grid-tied and off-grid functionalities with energy storage
capabilities
- Solar Monitoring Systems: Performance tracking and real-time data monitoring for solar power
systems
- Smart Home Integration: Energy management and optimization through home automation
connectivity
- Electric Vehicle Charging Stations: Solar-powered EV charging solutions converting solar energy for
vehicle charging
- Renewable Energy Systems: Integration with larger renewable energy setups including wind
energy systems
Technical Specifications
| PCB Layers | 1-42 layers |
| PCB Materials | CEM1, CEM3, Rogers, FR-4, High Tg FR-4, Aluminum Base, Halogen Free |
| Maximum Board Size | 620mm * 1100mm |
| Certification | RoHS Directive-Compliant |
| PCB Thickness | 1.6 ±0.1mm |
| Outer Layer Copper Thickness | 0.5-5oz |
| Inner Layer Copper Thickness | 0.5-4oz |
| Maximum Board Thickness | 6.0mm |
| Minimum Hole Size | 0.20mm |
| Minimum Line Width/Space | 3/3mil |
| Minimum Solder Mask Pitch | 0.1mm (4mil) |
| Plate Thickness and Aperture Ratio | 30:1 |
| Minimum Hole Copper | 20µm |
| Hole Diameter Tolerance (PTH) | ±0.075mm (3mil) |
| Hole Diameter Tolerance (NPTH) | ±0.05mm (2mil) |
| Hole Position Deviation | ±0.05mm (2mil) |
| Outline Tolerance | ±0.05mm (2mil) |
| PCB Solder Mask Colors | Black, white, yellow |
| PCB Surface Finishes | HASL Leadfree, Immersion ENIG, Chem Tin, Flash Gold, OSP, Gold
finger, Peelable, Immersion Silver |
| Legend Color | White |
| Electrical Testing | 100% AOI, X-ray, Flying probe test |
| Outline Processing | Rout and Score/V-cut |
| Inspection Standard | IPC-A-610C CLASS II |
| Certificates | UL (E503048), ISO9001/ISO14001/IATF16949 |
| Outgoing Reports | Final Inspection, E-test, Solderability Test, Micro Section and
more |
Manufacturing Facility
High Frequency Multilayer PCB Rigid Printed Circuit Boards For Consumer Electronics
