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Multilayer Rigid High Frequency PCB Board For Industrial Automation Communications

Multilayer Rigid High Frequency PCB Board For Industrial Automation Communications

Multilayer Rigid High Frequency PCB Board For Industrial Automation Communications
Multilayer Rigid High Frequency PCB Board For Industrial Automation Communications
Categories High Frequency PCB
Brand Name: TECircuit
Model Number: TEC0163
Certification: UL,ISO 9001, ISO 14001, ISO 13485, ITAF 16949, ROHS,REACH. W
Place of Origin: China
MOQ: 1pcs for sample, 100pcs for bulk
Price: USD 1.99 ~ USD9.99/pcs
Payment Terms: L/C, D/A, D/P, T/T, Western Union, MoneyGram
Supply Ability: 50000 pcs/month
Delivery Time: 5-15 wotk days
Packaging Details: Vacuum package+Carton box
Brand: Shenzhen Tecircuit Electronics Co., Ltd
Product Type: PCB,High frequency board,RIGID PCB,Rigid board,Flexible board,Rigid-Flex PCB,IC-Substrate,Metal Core
Item No.: R0066
Service: PCBA service
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Company Info.
Shenzhen Tecircuit Electronics Limited
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Multilayer Rigid High Frequency PCB Board For Industrial Automation Communications

Product Images


About TECircuit


Found: TECircuit has been operating since 2004.

Location: An electronics manufacturing service(EMS) provider located in Shenzhen China.

Item: Customizable EMS PCB, offers a full range of one-stop shop services.

Service: Printed Circuit Board (PCB)and Printed Circuit Board Assembly(PCBA), Flexible Printed Circuit Board(FPC), Components Sourcing, Box-Building, Testing.

Quality Assurance: UL,ISO 9001, ISO 14001, ISO 13485, ITAF 16949 andcomplied with ROHS and REACH.

Factory Pictures:
Company's own plant : 50,000 sqm; Employees : 930+; Monthly production capacity : 100,000 m2


Product Applications


  • Control Systems:

    • Used in programmable logic controllers (PLCs) and distributed control systems (DCS) for managing automation processes and machinery.

  • Sensor Interfaces:

    • Employed in PCBs that connect various sensors (temperature, pressure, flow) to control systems, enabling real-time data acquisition.

  • Communication Protocols:

    • Integrated into devices that support industrial communication protocols such as CAN, Modbus, Profibus, and Ethernet, facilitating data exchange between devices.

  • Robotics:

    • Used in PCBs for robotic controllers, enabling communication between sensors, actuators, and central processing units.

  • Machine Vision Systems:

    • Employed in systems that utilize cameras for quality control and inspection, providing high-speed data transfer to processing units.

  • Industrial IoT (IIoT):

    • Integrated into IIoT devices that connect machinery and sensors to cloud services for data analytics and remote monitoring.

  • Networked Equipment:

    • Used in network switches and routers for industrial applications, ensuring reliable data communication across machines and systems.

  • Field Devices:

    • Employed in various field devices such as smart meters and actuators, enabling efficient communication in industrial settings.

  • Data Acquisition Systems:

    • Integrated into systems that collect and analyze data from multiple sources, ensuring accurate and timely information for decision-making.

  • Power Distribution Systems:

    • Used in communication circuits within power management systems, facilitating the control and monitoring of power distribution.

Product Features

  1. Low Dielectric Loss:

    • Made from materials with low dielectric loss to minimize signal degradation, ensuring effective communication at high frequencies.

  2. High Precision Design:

    • Requires tight tolerances and high-quality manufacturing to maintain signal integrity and performance in critical applications.

  3. Controlled Impedance:

    • Designed to maintain specific impedance levels (commonly 50 ohms), preventing signal reflections and ensuring efficient power transfer.

  4. Multi-layer Construction:

    • Often utilizes multi-layer designs to optimize routing, reduce electromagnetic interference (EMI), and provide shielding for sensitive components.

  5. Thermal Management:

    • Capable of dissipating heat effectively to ensure reliable operation of high-power components in demanding environments.

  6. Enhanced Signal Integrity:

    • Supports high-speed data transmission with minimal loss, critical for effective communication in automation systems.

  7. Robustness and Durability:

    • Built to withstand harsh industrial conditions, including temperature extremes, vibrations, and exposure to chemicals.

  8. Regulatory Compliance:

    • Designed to meet industry standards for safety and performance, ensuring dependable operation in various industrial applications.

  9. Customizable Designs:

    • Can be tailored to specific automation requirements, allowing for unique layouts and configurations to suit different applications.

  10. Ease of Integration:

    • Compatible with standard components and communication protocols, facilitating seamless integration into existing industrial systems.

FAQ

Question 1: What is needed for a quotation?
Answer:
PCB: QTY, Gerber file, and Technical Requirements( material/surface finish treatment/copper thickness/board thickness,...)
PCBA: PCB information, BOM,(Testing documents...)

Q2: What file formats do you accept for production?
Answer:
PCB Gerber file
BOM list for PCB
Test method for PCBA

Q3: Are my files safe?
Answer:
Your files are held completely safe and secure. We protect the IP for our customers in the whole process. All documents from customers are never shared with any 3rd parties.

Q4: What is the shipment method?
Answer:
We can offer FedEx /DHL / TNT / UPS for shipment. Also, customer provided shipment method is acceptable.

Q5: What is the payment method?
Answer:
Telegraphic Transfer in advance (Advance TT, T/T), PayPal is acceptable.

​Product Description​

Specification:
PCB layers:1-42layers
PCB materials:CEM1, CEM3, Rogers, FR-4, High Tg FR-4, Aluminum Base, Halogen Free
PCB max. board size:620mm*1100mm
PCB certificate:RoHS Directive-Compliant
PCB Thickness:1.6 ±0.1mm
Out Layer Copper Thickness:0.5-5oz
Inner Layer Copper Thickness:0.5-4oz
PCB max. board thickness:6.0mm
Minimum Hole Size:0.20mm
Minimum Line Width/Space:3/3mil
Min. S/M Pitch:0.1mm(4mil)
Plate Thickness and Aperture Ratio :30:1
Minimum Hole Copper:20µm
Hole Dia. Tolerance(PTH):±0.075mm(3mil)
Hole dia. Tolerance(NPTH):±0.05mm (2mil)
Hole Position Deviation:±0.05mm (2mil)
Outline Tolerance:±0.05mm (2mil)
PCB solder mask:Black, white, yellow
PCB surface finished:HASL Leadfree,Immersion ENIG,Chem Tin,Flash Gold,OSP,Gold finger,Peelable,Immersion Silver
Legend:White
E-test:100% AOI, X-ray, Flying probe test.
Outline:Rout and Score/V-cut
Inspection Standard:IPC-A-610CCLASSII
Certificates:UL (E503048),ISO9001/ISO14001/IATF16949
Outgoing Reports:Final Inspection, E-test, Solderability Test, Micro Section and More
Product Tags:

Industrial Automation High Frequency PCB

  

Communications High Frequency PCB Board

  

Multilayer Rigid High Frequency PCB

  
Buy Multilayer Rigid High Frequency PCB Board For Industrial Automation Communications at wholesale prices

Multilayer Rigid High Frequency PCB Board For Industrial Automation Communications

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