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Rogers RO3203 PCB 20mil Green Soldermask Immersion Tin

Categories RF PCB Board
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Place of Origin: CHINA
MOQ: 1PCS
Price: USD9.99-99.99/PCS
Payment Terms: T/T
Supply Ability: 5000PCS per month
Delivery Time: 8-9 working days
Packaging Details: Vacuum bags+Cartons
Material: RO3203
Layer count: 2-layer
PCB size: 65.78mm x 37.48 mm=1PCS
PCB thickness: 20 mil
Copper weight: 1oz (1.4 mils) outer layers
Surface finish: Immersion Tin
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Rogers RO3203 PCB 20mil Green Soldermask Immersion Tin

The Rogers RO3203 PCB represents the latest advancement in high-frequency circuit materials, specifically engineered for exceptional electrical performance and mechanical stability. Constructed from ceramic-filled laminates reinforced with woven fiberglass, the RO3203 builds upon the legacy of the RO3000 Series, distinguished by its improved mechanical stability. With a dielectric constant of 3.02 and a low dissipation factor of 0.0016, this material extends the operational frequency range beyond 40 GHz, making it an ideal choice for a variety of demanding applications.


Key Features
The Rogers RO3203 PCB is designed with several standout features that enhance its performance and usability:


High-Frequency Performance: The dielectric constant of 3.02 ± 0.04 at 10 GHz ensures reliable signal integrity.


Low Dissipation Factor: With a dissipation factor of 0.0016 at 10 GHz, it minimizes energy losses, supporting high-frequency applications.


Thermal Stability: The material can withstand temperatures above 500°C, making it suitable for a wide range of environments.


Thermal Conductivity: At 0.87 W/mK, it effectively manages heat dissipation, which is crucial for high-performance circuits.


Coefficient of Thermal Expansion: The low CTE (X: 13 ppm/°C, Y: 13 ppm/°C, Z: 58 ppm/°C) matched to copper ensures reliable performance in epoxy multi-layer board hybrid designs.


Lead-Free Process Compatibility: Compliant with environmental standards, including a 94V-0 flammability rating, making it suitable for modern manufacturing processes.


PropertyRO3203DirectionUnitsConditionTest Method
Dielectric Constant,εProcess3.02±0.04Z10 GHz/23℃IPC-TM-650 2.5.5.5
Dissipation Factor,tanδ0.0016Z10 GHz/23℃IPC-TM-650 2.5.5.5
Thermal Conductivity0.47 (3.2)W/mKFloat 100℃ASTM C518
Volume Resistivity107MΩ.cmAASTM D257
Surface Resistivity107AASTM D257
Dimensional Stability0.08X, Ymm/m +E2/150after etchIPC-TM-650 2.4.3.9
Tensile ModulusX YkpsiRTASTM D638
Flexural Modulus400 300X YkpsiAASTM D790
Tensile Strength12.5 13X YkpsiRTASTM D638
Flexural Strength9 8X YkpsiAASTM D790
Moisure Absorption<0.1%D24/23IPC-TM-650 2.6.2.1
Coefficient of Thermal Expansion58 13Z X,Yppm/℃-50 ℃to 288℃ASTM D3386
Td500TGAASTM D3850
Density2.1gm/cm323℃ASTM D792
Copper Peel Stength10 (1.74)lbs/in (N/mm)After solderIPC-TM-650 2.4.8
FlammabilityV-0UL 94
Lead-Free Process CompatibleYes

Benefits
The RO3203 PCB offers numerous advantages that make it ideal for high-frequency applications:


Improved Rigidity: The woven glass reinforcement enhances rigidity, facilitating easier handling during assembly and manufacturing.


Uniform Performance: It provides consistent electrical and mechanical performance, making it perfect for complex multi-layer structures.


Low Dielectric Loss: This feature supports high-frequency applications exceeding 20 GHz, ensuring optimal signal transmission.


Excellent Dimensional Stability: High production yields are achievable due to its stability, making it a reliable choice for large-scale manufacturing.


Cost-Effective: The RO3203 is competitively priced, making it an economical option for volume manufacturing.


Technical Specifications


The Rogers RO3203 PCB features a 2-layer rigid stackup, designed for optimal performance:


Copper Layer 1: 35 μm

RO3203 Substrate: 20 mil (0.508 mm)

Copper Layer 2: 35 μm


The finished board dimensions are 65.78 mm x 37.48 mm, with a total thickness of 0.6 mm. It supports minimum trace and space of 5/5 mils and has a minimum hole size of 0.4 mm. The finished copper weight on the outer layers is 1 oz (1.4 mils), and the surface finish is immersion tin. Each board undergoes 100% electrical testing prior to shipment to ensure quality and reliability.


The Rogers RO3203 PCB is suitable for a wide range of applications, including automotive collision avoidance systems, GPS antennas, wireless telecommunications systems, microstrip patch antennas, direct broadcast satellites, data links in cable systems, remote meter readers, and power backplanes. Its versatility and high performance make it an invaluable asset in various industries, including automotive and telecommunications.


For more information or to place an order, please contact our sales team or visit our website. Experience the reliability and efficiency of the Rogers RO3203 PCB in your next project.



PCB Material:Ceramic-filled Laminates Reinforced with Woven Fiberglass
Designation:RO3203
Dielectric constant:3.02±0.04
Layer count:Double Layer, Multilayer, Hybrid PCB
Copper weight:0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness:10mil (0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil(1.524mm)
PCB size:≤400mm X 500mm
Solder mask:Green, Black, Blue, Yellow, Red etc.
Surface finish:Bare copper, HASL, ENIG, OSP etc..
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