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Double Sided RT Duroid 6035HTC PCB 10mil Immersion Silver Circuits

Categories RF PCB Board
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Place of Origin: CHINA
MOQ: 1PCS
Price: USD9.99-99.99/PCS
Payment Terms: T/T
Supply Ability: 5000PCS per month
Delivery Time: 8-9 working days
Packaging Details: Vacuum bags+Cartons
Material: RT/duroid 6035HTC - 0.254 mm (10mil)
Layer count: 2-layer
PCB size: 54mm x 76 mm=1PCS, +/- 0.15mm
PCB thickness: 0.3 mm
Copper weight: 1oz (1.4 mils) outer layers
Surface finish: Immersion Silver
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Double Sided RT Duroid 6035HTC PCB 10mil Immersion Silver Circuits

Introduction to RT/Duroid 6035HTC
Rogers RT/Duroid 6035HTC is a high-frequency circuit material that combines ceramic-filled PTFE composites, making it an exceptional choice for high-power RF and microwave applications. This laminate boasts thermal conductivity nearly 2.4 times that of standard RT/Duroid 6000 products, ensuring excellent long-term thermal stability when paired with copper foil (both ED and reverse-treated). Furthermore, Rogers’ advanced filler system enhances drillability, significantly reducing drilling costs compared to traditional high thermally conductive laminates that utilize alumina fillers.


Key Features
Dielectric Constant (DK): 3.5 ± 0.05 at 10 GHz/23°C.
Dissipation Factor: 0.0013 at 10 GHz/23°C.
Thermal Coefficient of Dielectric Constant: -66 ppm/°C.
Moisture Absorption: 0.06%.
Thermal Conductivity: 1.44 W/m/K at 80°C.
Coefficient of Thermal Expansion (CTE): 19 ppm/°C in both X and Y axes, 39 ppm/°C in the Z-axis.


These characteristics ensure that RT/Duroid 6035HTC PCB meets the rigorous demands of modern electronics, providing a stable platform for high-frequency applications.


PropertyRT/duorid 6035HTCDirectionUnitsConditionTest Method
Dielectric Constant,εProcess3.50±0.05Z10 GHz/23℃IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign3.6Z8 GHz - 40 GHzDifferential Phase Length Method
Dissipation Factor0.0013Z10 GHz/23℃IPC-TM-650 2.5.5.5
Thermal Coefficient of ε-66Zppm/℃-50 ℃to 150℃mod IPC-TM-650, 2.5.5.5
Volume Resistivity108MΩ.cmAIPC-TM-650, 2.5.17.1
Surface Resistivity108AIPC-TM-650, 2.5.17.1
Dimensional Stability-0.11 -0.08CMD MDmm/m (mils/inch)0.030" 1oz EDC foil Thickness after etch '+E4/105IPC-TM-650 2.4.39A
Tensile Modulus329 244MD CMDkpsi40 hrs @23℃/50RHASTM D638
Moisure Absorption0.06%D24/23IPC-TM-650 2.6.2.1 ASTM D570
Coefficient of Thermal Expansion (-50 ℃to 288 ℃)19 19 39X Y Zppm/℃23℃ / 50% RHIPC-TM-650 2.4.41
Thermal Conductivity1.44W/m/k80℃ASTM C518
Density2.2gm/cm323℃ASTM D792
Copper Peel Stength7.9pli20 sec. @288 ℃IPC-TM-650 2.4.8
FlammabilityV-0UL 94
Lead-Free Process CompatibleYes

Why Choose RT/Duroid 6035HTC?

Outstanding Thermal Management: The high thermal conductivity allows for superior heat dissipation, resulting in cooler operating temperatures for high-power applications. This translates to enhanced reliability and longevity for electronic components.

Impressive Dielectric Performance: With a low dissipation factor, RT/Duroid 6035HTC minimizes insertion loss, ensuring that signals remain strong and clear even at elevated frequencies.

Long-lasting Stability: The combination of excellent thermal and electrical properties guarantees that this PCB maintains its performance over time, even under demanding conditions.


PCB Construction details
This 2-layer rigid PCB featuring a specific stackup: Copper Layer 1 at 35 μm, an RT/Duroid 6035HTC core of 0.254 mm (10 mil), and Copper Layer 2 also at 35 μm. Detailed construction specifications include board dimensions of 54 mm x 76 mm (± 0.15 mm), a minimum trace/space of 4/4 mils, and a minimum hole size of 0.2 mm. The finished board thickness is 0.3 mm, with a finished copper weight of 1 oz (1.4 mils) for outer layers. The PCB is also rigorously tested, with 100% electrical testing conducted prior to shipment.



Artwork and Standards
This PCB is supplied with Gerber RS-274-X artwork and complies with IPC-Class-2 standards, ensuring high quality and reliability throughout the production process.


Global Availability
The RT/Duroid 6035HTC PCB is available worldwide, making it accessible to engineers and manufacturers across various sectors, enhancing their design capabilities.


PCB Material:Ceramic-filled PTFE composites
Designation:RT/duroid 6035HTC
Dielectric constant:3.50±0.05
Layer count:Double Layer, Multilayer, Hybrid PCB
Copper weight:0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Laminate thickness:10mil (0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil(1.524mm)
PCB size:≤400mm X 500mm
Solder mask:Green, Black, Blue, Yellow, Red etc.
Surface finish:Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP etc..

Typical Applications
The versatility and reliability of RT/Duroid 6035HTC make it ideal for a range of applications, including:


High-Power RF and Microwave Amplifiers: Essential for effective signal amplification in communication systems.

Power Amplifiers and Couplers: Providing stable performance in demanding RF environments.

Filters and Combiners: Enabling effective signal management in complex circuits.

Power Dividers: Facilitating reliable signal distribution in RF applications.


Conclusion
The RT/Duroid 6035HTC PCB is a transformative solution for high-frequency and high-power applications. As the electronics industry continues to evolve, RT/Duroid 6035HTC is positioned to meet the challenges of tomorrow's high-power applications, ensuring that your designs are both reliable and efficient.


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