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TIF300 Efficient Thermal Conductivity Silicone Thermal Pads For Electronics Cooling

Categories Thermal Pad
Brand Name: Ziitek
Model Number: TIF300
Certification: RoHS
Place of Origin: Vietnam
MOQ: 1000pcs
Price: 0.1-10 USD/PCS
Payment Terms: T/T
Supply Ability: 100000pcs/day
Delivery Time: 3-5 work days
Packaging Details: 24*13*12cm cartons
Products name: Efficient Thermal Conductivity Silicone Thermal Pads For Electronics Cooling
Materials: Ceramic filled silicone elastomer
Hardness: 27±5 Shore 00
Flame rating: 94-V0
Specific Gravity: 3.05 g/cc
Keywords: Silicone Thermal Pads
Thermal conductivity: 3.0W/mK
Color: Gray
Application: Electronic Component Gap Filling
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  • Company Profile

TIF300 Efficient Thermal Conductivity Silicone Thermal Pads For Electronics Cooling

Efficient Thermal Conductivity Silicone Thermal Pads For Electronics Cooling

Product descriptions


TlF®300 series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the efficiency and life-time of the heat-generating electronic components.

Features


> Good thermal conductivity
> Naturally tacky needing no furtheradhesive coating
> Soft and Compressible for low stress application
> Available in varies thickness

> Easy release construction
> Electrically isolating
> Moldability for complex parts


Application


> LED Ceilinglamp
> Monitoring the Power Box
> AD-DC Power Adapters
> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices
> Automotive electronics

Typical Properties of TIF®300 Series
ColorGrayVisual
Construction & CompostionCeramic filled silicone elastomer******
Thickness range0.020"~0.200"(0.50~5.0mm)ASTM D374
Hardness27±5 (Shore 00)ASTM 2240
Specific Gravity3.05 g/ccASTM D297
Continuos Use Temp(℃)-40~160℃******
Dielectric Breakdown Voltage>5500 VACASTM D149
Dielectric Constant4.5 MHzASTM D150
Volume Resistivity1.0X10¹² Ohm-meterASTM D257
Thermal conductivity3.0W/m-KASTM D5470
Outgassing (TML)0.35%ASTM E595
Flame RatingV-0UL 94

Standard Thicknesses

0.020-inch to 0.200-inch (0.5mm to 5.0mm)


Product Sizes:

8" x 16"(203mm x406mm),Individual die cut shapesand and custom thickness can be supplied.

Please contact us for confirming

Packaging Details & Lead time


The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized


Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated


Company Profile


Vietnam Ziitek Technology Company Limited is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad and heat-conducting grease, heat-conducting plastic, silicone rubber, silicone rubber foam, etc. We adhere to the business philosophy of "survival by quality, development by quality", and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation.


Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL


Ziitek Culture


Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

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