ESD Factory Circuits QFP QFN Plastic Molded Electronic Parts Packaging Tray

ESD Factory Circuits QFP QFN Plastic Molded Electronic Parts Packaging Tray

Built to global JEDEC standards, our trays offer repeatable performance, high dimensional accuracy, and long-term reliability.

Designed to meet the rigorous demands of modern semiconductor and electronics manufacturing, the JEDEC matrix tray delivers dependable performance in automated and manual environments. Made from high-performance, ESD-safe material, it ensures component protection from electrostatic discharge and physical damage. Precision-molded pockets securely hold each unit in place, while integrated alignment features simplify setup on conveyors, feeders, and robotic systems. With its robust structure and compatibility across JEDEC-standard processes, this tray helps manufacturers reduce error rates and improve process consistency across the board.

Features & Benefits:

• JEDEC-Compliant Design: Universally compatible with JEDEC-standard handling systems, reducing integration costs and setup time.

• ESD-Resistant Material: Built with conductive polymers that dissipate electrostatic charges to protect sensitive components.

• Secure Component Seating: Molded cells prevent device shifting during transit, handling, or pick-and-place operations.

• Optimized for Automation: Chamfered corners, flat pocket bottoms, and pick-up recesses enable seamless use with vacuum tools and automated handling.

• Rugged & Reusable: Designed to withstand high-throughput usage cycles in industrial environments without deformation or cracking.

• Stackable with Stability: Stacking features align trays precisely and prevent sliding, supporting safe and space-efficient vertical storage

Technical Parameters:

Application:

This tray is well-suited for processes including device testing, SMT component placement, IC packaging, and logistics. Its structural rigidity and dimensional consistency make it ideal for systems requiring tight tolerances, including robotic pick-and-place arms and vacuum feeders. It is used widely in industries such as microelectronics, photonics, communications, and automotive electronics, where part protection and process uniformity are essential.

Customization:

Various customization options are available to support specialized workflows and proprietary component shapes:

• Pocket Layout Adjustments: Customize pocket depth, width, and geometry to fit unique package types or irregular device forms.

• Color Variations: Use distinct ESD-safe color materials for part categorization, production tracking, or process segregation.

• Molded Identifiers: Integrate permanent raised codes, customer-specific marks, or internal tracking indicators into the tray during manufacturing.

• Feature Modifications: Add mechanical locating features, altered support structures, or specialized vacuum access points to suit unique automation or transport setups.