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GS600SU GS600SUA Underfill Dispensing Machine for Die Form Underfill FCBGA FCCSP SIP Packaging CUF Application

Categories Adhesive Dispensing Machine
Brand Name: MingSeal
Model Number: GS600SU
Certification: CE/ISO
Place of Origin: China
MOQ: 1
Price: $28000-$150000
Payment Terms: L/C, T/T, D/A, D/P, MoneyGram, Western Union
Delivery Time: 5-60 days
Packaging Details: WOODEN
Condition: New
Voltage: 110V/220V
Automatic grade: Automatic
After-sales service provided: Engineers available to service machinery overseas,Online support,Video technical support,Free spare parts
Warranty: 1 Year
Product name: Underfill Dispensing Machine
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GS600SU GS600SUA Underfill Dispensing Machine for Die Form Underfill FCBGA FCCSP SIP Packaging CUF Application

GS600SU Underfill Dispensing Machine

for Die Form Underfi ll


GS600 SU is a high- speed and high- precision automatic online dispensing system which is developed based on Underfill process requirements of FCBGA/FCCSP.

The system strictly controls the product and adhesive temperature, and intelligently sorts the product operation sequence and the glue replenishment time, reducing the generation of voids and ensuring the operation yield. Meanwhile, it is compatible with international semiconductor communication protocols, and matches the infor- mation management requirements.

Application Fields
FCBGA Packaging CUF Application FCCSP Packaging CUF Application SiP Packaging CUF Application


■ Technical Specifications

Application FieldsFCBGA, FCCSP, SIP
Applicable ProcessDie Form Underfill
Cleanliness LevelCleanliness of working area

Class 100 (Class 1000 workshop)

Class 10 (Class 100 workshop)




Transmission

Mechanism

Transmission systemX/Y:Linear motor Z: Servo motor&Screw module
Repeatability (3sigma)X/Y: ±0.003mm, Z: ±0.005mm
Positioning accuracy (3sigma)X/Y: ±0.010mm, Z: ±0.015mm
Max. movement speedX/Y: 1000mm/s
Z: 500mm/s
Max. accelerated velocityX/Y: 1g, Z: 0.5g
Grating resolution1 μ m
Z axis movement range(W× D)3 5 0 mm×4 7 0mm
Z axis height calibration & compensation MethodLaser sensor (Laser sensor)
Laser sensor accuracy2μ m





Dispensing System

Glue control accuracy± 3 % / 1mg
Single dot position repeatability CPK>1.0±25 μ m
Min. nozzle diameter30 μ m
Min. single dot glue weight0 .001mg/dot
Max. fluid viscosity200000cps
Max. jetting frequency1000Hz
Runner/nozzle heating temperatureRoom temperature~200℃
Runner/nozzle heating temp. deviation± 2 ℃
Applicable adhesive packaging spec.5CC/10CC/30CC/50CC/70CC
Syringe cooling rangeCools down to 15°C below ambient temp.
Piezo cooling rangeCools down to compressed air source temp.






Track System

Number of tracks2
Number of belt sectionsOne piece
Max. track transmission speed300mm/s
Max. track transmission weight3kg
Minimum edge clearance3 mm
Track width adjustment range60mm~ 162mm Adjustable
Track width adjustment MethodManual
Track height910mm~960mm Adjustable
Max. thickness of applicable substrate/carrier6 mm
Applicable substrate/carrier length range60mm-325mm
Vacuum suction pressure Range-50~-80Kpa Adjustable
Bottom heating temperature rangeRoom temperature~180℃
Bottom heating temp. deviation≤ ± 1 . 5 ℃



Facilities

Footpri nt W× D× H2380mm*1550mm*2080mm(Loading&Unloading& display included)
2380mm*1200mm*2080mm(Loading&Unloading included, display excluded)
Weight1600kg
Power supply200~240VAC,47~63HZ (Single-phase voltage adaptation power supply)
Electric current30A
Power6.4KW
Inhale(0.5Mpa, 450L/min) ×2
  • FCBGA Packaging CUF Application
  • FCCSP Packaging CUF Application
  • SiP Packaging CUF Application

Special Process Modules

  • shijuexitong

    CUF Special Piezoelectric Jetting System
    Adhesive insulation + piezoelectric ceramic temperature closed-loop control to avoid system instability caused by temperature influence

  • Triple Low-level Alarm

    Triple Low-level Alarm
    Capacitive detection + magnetic detection + system weighing to avoid poor operation caused by lack of glue

  • Vacuum Adsorption Heating Fixture

    Vacuum Adsorption Heating Fixture
    The temperature difference of the whole surface of the fixture is ≤ ±1.5°C, and the temperature is monitored and compensated in real time to avoid poor operation caused by product temperature variation during operation

  • Press-Down Track

    Press-Down Track
    The vacuum adsorption fixture always keeps still, and the track moves up and down to avoid poor operation caused by loss of flatness during reciprocating movement of the vacuum adsorption fixture.

  • 平台式上下料系统

    Platform-Type Loading & Unloading System
    The feeding sequence is automatically sorted, and the operation is completed within the Plasma time limit
    Friendly human-machine interface design

  • 视觉系统

    Visual system
    Positioning and detection functions
    Inspection before operation to avoid defective incoming materials
    Inspection after operation to prevent batch defects

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