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RO3003G2 PCB 5mil 2-layer Immersion Gold Circuits

Categories RF PCB Board
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Place of Origin: CHINA
MOQ: 1PCS
Price: USD9.99-99.99/PCS
Payment Terms: T/T
Supply Ability: 5000PCS per month
Delivery Time: 8-9 working days
Packaging Details: Vacuum bags+Cartons
Material: RO3003G2
PCB size: 41.71mm x 64mm=1PCS, +/- 0.15mm
Copper weight: 1oz (1.4 mils)
Surface finish: Immersion gold
Layer count: 2-layer
PCB Thickness: 0.2mm
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RO3003G2 PCB 5mil 2-layer Immersion Gold Circuits

The Rogers RO3003G2 is a high-performance, ceramic-filled PTFE laminate designed for millimeter wave automotive radar applications. This latest iteration of Rogers' industry-leading RO3003 solutions was developed based on customer feedback to address the next-generation needs of ADAS (Advanced Driver Assistance Systems) like adaptive cruise control, forward collision warning, and lane change assist.


Key Features:
- Dielectric constant (Dk) of 3.0 ±0.04 at 10 GHz and 3.07 at 77 GHz
- Low dissipation factor of 0.0011 at 10 GHz
- Excellent thermal coefficient of dielectric constant (-35 ppm/°C)
- Very low profile (VLP) electrodeposited (ED) copper
- Copper-matched coefficient of thermal expansion (CTE) for enhanced reliability
- Homogeneous construction with reduced dielectric porosity


PROPERTYRO3003G2DirectionUnitconditionTest Method
Dielectric Constant, er Process3.00 ± 0.04Z-10 GHz 23°CIPC-TM-650
2.5.5.5
Clamped Stripline
Dielectric Constant, er Design3.07Z-77 GHZDifferential Phase
Length Method
Dissipation Factor, tan d0.0011Z-10 GHz 23°CIPC-TM-650
2.5.5.5
Thermal Coefficient of er-35Zppm/°C10 GHz
-50 to 150°C
IPC-TM-650
2.5.5.5
Dimensional Stability-0.16
-0.14
X
Y
mm/mMethod CIPC TM-650 2.2.4
Volume Resistivity1.4 x 10^9-MΩ•cmCOND AIPC 2.5.17.1
Surface Resistivity2.6 x 10⁸-MΩCOND AIPC 2.5.17.1
Tensile Modulus378
396
X
Y
ksi23°CASTM D638
Moisture Absorption0.06-%D48/50IPC-TM-650
2.6.2.1
Specific Heat0.73
0.83
ZJ/g/K0°C
50°C
ASTM E1269-11
Thermal Conductivity0.43ZW/m/K50°CASTM D5470
Coefficient of Thermal Expansion16
17
18
X
Y
Z
ppm/°C23°C/50% RHIPC-TM-650 2.4.41
Td500-°CTGA-ASTM D3850
Density2.15-gm/cm323°CASTM D792
Copper Peel Strength12.0-lb/in1/2 oz. EDC
After Solder Float
IPC-TM-2.4.8
FlammabilityV-0---UL 94
Lead Free Process CompatibleYES----

PCB Material:Ceramic-filled PTFE Laminates
Designation:RO3003G2
Dielectric constant:3
Dissipation factor0.0011
Layer count:Single Sided, Double Sided, Multi-layer PCB, Hybrid PCB
Copper weight:1oz (35µm), 2oz (70µm)
Dielectric thickness5mil (0.127mm), 10mil (0.254mm)
PCB size:≤400mm X 500mm
Solder mask:Green, Black, Blue, Yellow, Red etc.
Surface finish:Immersion gold, HASL, Immersion silver, Immersion tin, ENEPIG, OSP, Bare copper, Pure gold etc..

Benefits:
- Best-in-class performance for insertion loss
- Minimized dielectric constant variation in finished PCB
- Enables the trend toward smaller-diameter vias


This 2-layer rigid PCB features a 0.127 mm (5 mil) Rogers RO3003G2 core with 35 μm copper layers. It measures 41.71 mm x 64 mm with a finished thickness of 0.2 mm. The PCB has a minimum trace/space of 4/5 mils, a minimum hole size of 0.3 mm, and an immersion gold surface finish.


Applications:

It meets IPC-Class-2 quality standards, the RO3003G2 PCB is well-suited for a variety of ADAS applications, including adaptive cruise control, forward collision warning, active brake assist, lane change assist, traffic jam pilot, parking pilot, and blind spot detection.


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