| Sign In | Join Free | My benadorassociates.com |
|
| Categories | IMU Accelerometer Gyro |
|---|---|
| Brand Name: | Firepower |
| Model Number: | MGZ332HC-P5 |
| Place of Origin: | CHINA |
| MOQ: | 1 |
| Payment Terms: | L/C,T/T |
| Supply Ability: | 500pcs |
| Delivery Time: | 1 week |
| Packaging Details: | Wooden box |
| Certification: | CE |
| Product Name: | MEMS Gyroscope Chip |
| Bias Instability: | 0.05°/h |
| Bias stability @10s: | <0.5°/h |
| (Bias stability @1s: | <1.5°/h |
| Angular Random Walk: | <0.025°/ √h |
| Bias error over temperature: | <5°/h |
| VRE: | <1°/hr/g |
| Data Rate: | 12K |
| Company Info. |
| Shenzhen Fire Power Control Technology Co., LTD |
| Verified Supplier |
| View Contact Details |
| Product List |
High Precision MEMS Gyroscope Chip with 0.05°/h Bias Instability for IMU Accelerometer Gyro
Product Description
MEMS Gyroscope Chip is a miniature solid-state angular rate sensor designed for accurate measurement of rotational velocity.It adopts advanced MEMS micromachining technology and closed-loop drive architecture to achieve high precision, low bias instability, and excellent vibration resistance.The chip delivers digital output through SPI or UART interface and is fully temperature compensated, ensuring consistent performance in dynamic environments.It is widely used in UAVs, robotics, vehicle stabilization systems, and tactical-grade inertial navigation units.
Main Paremeters
| performance | MGZ332HC-P1 | MGZ332HC-P5 | MGZ318HC-A1 | MGZ221HC-A4 | MGZ330HC-O1 | MGZ330HC-A1 | |
| Range | deg/s | 400 | 400 | 400 | 400 | 400 | 100 |
| Band Width @3DB customized) | Hz | 90 | 180 | 200 | 200 | 300 | 50 |
| Output accuracy(digital SPI) | bits | 24 | 24 | 24 | 24 | 24 | 24 |
| Output rate(ODR)(customized) | Hz | 12K | 12K | 12K | 12K | 12K | 12K |
| Delay(customized) | ms | <3 | <1.5 | <1.5 | <1.5 | <1 | <6 |
| Bias stability | deg/hr(1o) | <0.05 | <0.05 | <0.1 | <0.5 | <0.1 | <0.02 |
| Bias stability (1σ 10s) | deg/hr(1o) | <0.5 | <0.5 | <1 | <5 | <1 | <0.1 |
| Bias stability (1σ 1s) | deg/hr(1o) | <1.5 | <1.5 | <3 | <15 | <3 | <0.3 |
| Bias error over temperature (1σ) | deg/hr(1o) | <5 | <5 | <10 | <30 | 10 | 5 |
| Bias temperature variations, calibrated(1σ) | deg/hr(1o) | <0.5 | <0.5 | <1 | <10 | <1 | <0.5 |
| Bias repeatability | deg/hr(1o) | <0.5 | <0.5 | <0.5 | <3 | <0.3 | <0.1 |
| Scale factor at 25°C | lsb/deg/s | 20000 | 20000 | 16000 | 16000 | 20000 | 80000 |
| Scale factor repeatability (1σ) | ppm(1o) | <20ppm | <20ppm | <20ppm | <20ppm | <100ppm | <100ppm |
| Scale factor vs temperature (1σ) | ppm(1o) | 100ppm | 100ppm | <100ppm | <100ppm | <300ppm | <300ppm |
| Scale factor non-linearity (1σ) | ppm | 100ppm | 100ppm | <150ppm | <150ppm | <300ppm | <300ppm |
| Angular random walk(ARW) | °/√h | <0.025 | <0.025 | <0.05 | <0.25 | <0.05 | <0.005 |
| Noise(Peak to Peak) | deg/s | <0.15 | <0.3 | <0.35 | <0.4 | <0.25 | <0.015 |
| GValue sensitivity | °/hr/g | <1 | <1 | <1 | <3 | <1 | <1 |
| Vibration rectification error(12gRMS,20-2000) | °/hr/g(rms) | <1 | <1 | <1 | <3 | <1 | <1 |
| Environmental suitability | |||||||
| Impact (power on) | 500g , 1ms | ||||||
| Impact resistance (power off) | 10000g , 10ms | ||||||
| vibration(power on) | 18g rms (20Hz to 2kHz) | ||||||
| Working temperature | -40ºC----+85ºC | ||||||
| Store temperature | -55ºC----+125ºC | ||||||
| Supply voltage | 5±0.25V | ||||||
| Current consumption | 45ma | ||||||
PCB Design
The decoupling capacitors for pins VCP, VREF, VBUF, and VREG should
be placed as close to the pins as possible, and the equivalent
resistance of the traces should be minimized. The other ends of the
decoupling capacitors for VREF, VBUF, and VREG are connected to the
nearest AVSS _ LN and then to signal ground via a magnetic bead.
The decoupling capacitors for VCC and VIO are also placed close to
the corresponding pins. When VCC is in normal operation, the
overall current will be about 35 mA, which requires a wide PCB
trace to ensure voltage stability. For smooth assembly of the
device, try to avoid routing under the package. Locate components
to avoid areas of stress concentration. It is necessary to avoid
large heat dissipation elements and areas with external mechanical
contact, extrusion and pulling, as well as areas where positioning
screws are prone to warping during overall installation.

|