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High Thermal Conductivity Superior Insulation Low Thermal Expansion High-Temperature Resistance Exceptional Flatness

Categories Alumina Ceramic
Place of Origin: Made In China,Zhejiang,Jinhua
Brand Name: Dayoo
MOQ: Negotiate
Price: Negotiate
Delivery Time: Negotiable
Payment Terms: Negotiable
Corrosion Resistance: Excellent
Purity: 96%,99%
Shape: Customizable
Precision Tolerance: High
Alumina Content: 92% & 95%
Color: White
Low Thermal Expansion: Excellent
Tensile Strength: 250 MPa
Electrical Insulation: Excellent
Dielectric Loss: 0.0002
Thermal Shock Resistance: Excellent
Mechanical Strength: High
High Temperature Resistance: Yes
Non-Toxic: Yes
Thermal Conductivity: 35 W/mK
Dimensional Tolerance: ±0.001 mm
Packaging Details: Carton
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High Thermal Conductivity Superior Insulation Low Thermal Expansion High-Temperature Resistance Exceptional Flatness

High Thermal Conductivity Superior Insulation Low Thermal Expansion High-Temperature Resistance Exceptional Flatness


Product Introduction

Alumina ceramic substrates are electronic ceramic base plates manufactured from high-purity alumina (Al₂O₃ content 96%-99.9%), featuring excellent insulation properties, high thermal conductivity and low dielectric loss. With precision-polished surfaces achieving roughness below Ra 0.1μm, these substrates are ideal for high-end applications including power electronic devices, LED packaging, and semiconductor modules.

Primary Applications

  • Power Electronics: IGBT module substrates, power MOSFET heat dissipation bases

  • LED Lighting: High-power LED chip packaging substrates

  • Semiconductors: RF/microwave circuit substrates, MEMS device carriers

  • Automotive Electronics: New energy vehicle electronic control system heat sinks

  • 5G Communications: Base station power amplifier heat dissipation substrates

Key Advantages

High Thermal Conductivity: 24-30W/(m·K), 10× better than standard PCB materials
Superior Insulation: Volume resistivity >10¹⁴Ω·cm
Low Thermal Expansion: 7.2×10⁻⁶/℃, excellent match with silicon wafers
High-Temperature Resistance: Continuous operation up to 850℃
Exceptional Flatness: ≤0.02mm/50mm surface flatness

Technical Specifications

ParameterStandard (96%)High Thermal (99%)
Al₂O₃ Content96%99%
Thermal Conductivity24W/(m·K)30W/(m·K)
Dielectric Constant9.5(1MHz)9.2(1MHz)
Flexural Strength300MPa350MPa
Thickness Range0.25-5mm0.25-5mm
Maximum Size150×150mm150×150mm

Manufacturing Process

  1. Powder Preparation: High-purity alumina powder (D50≤1μm)

  2. Tape Casting: Precise slurry viscosity and thickness control

  3. Isostatic Pressing: 200MPa high-pressure densification

  4. High-Temp Sintering: 1600℃ atmosphere-protected sintering

  5. Precision Machining: Double-side grinding + laser cutting

  6. Surface Treatment: Chemical mechanical polishing (CMP)

  7. Full Inspection: Automated optical inspection (AOI)

Usage Guidelines

Installation Notes:

  • Recommended soldering temperature <300℃

  • Avoid mechanical impact and localized stress concentration

  • Storage humidity should be <60% RH

  • Consider CTE matching when assembling with other materials

  • Recommend using silver paste or AuSn solder for mounting

Service Commitment

  • Technical Support: Thermal simulation analysis services

  • Rapid Response: 72-hour expedited delivery for standard sizes

  • Customization: Special shapes and metallization treatments available

  • Failure Analysis: Equipped with SEM+EDS testing equipment

Technical FAQ

Q: How to select proper substrate thickness?
A: 0.63mm recommended for general power devices, ≥1.0mm for high-power applications

Q: Is multilayer wiring possible?
A: LTCC multilayer co-fired substrate solutions available

Q: What metallization options exist?
A: Supports thick-film printing, thin-film sputtering, DBC and other processes



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