2-inch 4-inch Optional Small Tray For IC Chip Handling Across Packaging And Inspection Clean Class General And Ultrasonic Cleaning

Small Tray For IC Chip Handling Across Packaging And Inspection

The Bare Die Tray (Chip Tray & Waffle Pack) series from Hiner-pack provides a secure and convenient solution for packaging and transporting Chip, Die, COG, Optoelectronic devices, and other microelectronic components. The series offers products in various sizes and materials, ensuring flexibility to meet diverse needs. The product specifications include options for 2 inches and 4 inches in size.

The materials used for these trays include Antistatic/Conductive ABS and PC, which are known for their durability and protective properties. Customers can also request customized solutions tailored to their specific requirements, ensuring that the packaging meets their unique needs with precision and efficiency.

Features:

• Molded of ESD-safe, non-sloughing, carbon-powder-free, clean polymers;
• Carbon-fiber reinforced for strength and permanent ESD protection;
• Up to 180°C bake temperature available;
• Industry-standard formats, customized for your needs.

Technical Parameters:

Specifications:

The external dimensions of waffle pack chip trays are standard: 2-inch trays are two inches square, 4-inch trays are four inches square, and so on. The variability lies in the pocket size, geometry, and count.

Waffle pack trays are typically defined by several characteristics:

• External size – 2”, 4”, etc.
• Pocket size or pocket count – selecting one will determine the other
• Temperature rating – the highest temperature at which the tray can be utilized

For custom waffle pack trays, additional specifications are required:

• Component geometry
• Special process requirements
• Quantity of trays needed or quantity of components to be processed (which helps in selecting the appropriate manufacturing process for tray production)