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| Categories | Epoxy Potting Compound |
|---|---|
| Brand Name: | Hanast |
| Model Number: | HN-5508AB |
| Certification: | MSDS |
| Place of Origin: | CHINA |
| MOQ: | 1KG |
| Price: | 6.3 |
| Payment Terms: | T/T |
| Supply Ability: | 1000000KG |
| Delivery Time: | 3-5 work days |
| Packaging Details: | Plastic/Iron Drums |
| Product name: | Epoxy Resin potting glue |
| Color: | Black/Grey/Transparent color, can customized |
| Application: | PCB/Battery/LED |
| Package: | 5kgs/25kgs/200kgs/bag |
| Material: | Epoxy Resin&Agent |
| Keywords: | Waterproof Sealant |
| Viscosity: | Excellent Viscosity |
| Certificate: | MSDS RoHS UL |
| Feature: | Low and high Temperature Resistance |
| Thermal conductivity: | Customize |
| Company Info. |
| Shenzhen Hanast New Material co.,LTD |
| Verified Supplier |
| View Contact Details |
| Product List |
Two-component Epoxy Potting Sealant Moisture-proof Fire Retardant High Temp Conductive Glue for Transformers Resistors Filters Electronic Appliances
HN-5508 Industrial Epoxy Resin Potting Glue
Product Specification
| Before curing | builder | Epoxy resin 5508 | Curing agent 5508 |
| pigment | Black / White et al | Ruburn / transparent surface | |
| Surface | A sticky epoxy resin water | r liquid specific | |
| specific gravity, g / cm3 | 1.4-1.5 | 1.05 | |
| Viscosity of 25℃ | 4,500—6,000cp s | 150—250cp storage | |
| storage Period (25℃) | Six months | x months | |
| processabilility | mixing ratio | A: B =5:1 (weight ratio) | |
| Available for a time of 25℃ | 2-3H (100g mix) | ||
| curing time | 25℃ / 6-8H surface stem, 12-16H fully cured or 60-80℃/1.5-2H | ||
| After curing | Tensile strength of kg/cm | 16-18 | |
| Compressive strength of kg/cm | 18-22 | ||
| Resistance to the voltage of kv/mm | 20-22 | ||
| Surface resistance ofΩ-cm | 14 | ||
| 1.2*10 | |||
| Volume resistance ofΩ-cm | 15 | ||
| 1.1*10 | |||
| contraction percentage% | 0.35-0.55 | ||
| Water absorption rate was 25℃ * 24H | <0.03% | ||
| The hardness of SHORE A | 85-95 | ||
| Distortion temperature ℃ | 130-150 | ||
| low temperature resistant ℃ | -30 | ||
Product Describtion
HN-5508 is a two-component epoxy potting compound designed for
room-temperature or low-temperature curing. With low viscosity,
extended work time, and excellent fluidity, it penetrates easily
into product gaps. After curing, it forms a bubble-free, smooth,
and glossy surface with high hardness. The cured material exhibits
outstanding resistance to acids, alkalis, moisture, and aging,
along with superior electrical insulation, voltage resistance, and
bonding strength. Ideal for electronic components requiring
encapsulation, insulation, and environmental protection.
Product Advantage
✅ Reliable Protection: Shields against moisture, vibration, and thermal stress.
✅ Versatile: Adapts to diverse electronic and industrial applications.
✅ Cost-Effective: Long pot life reduces waste during processing.
Technical parameters
Viscosity (Component A: 4500-6000 cps, Component B: 150-250 cps)
Hardness (SHORE D): 85-95
Tensile strength: 16-18 kg/cm²
Compressive strength: 18-22 kg/cm²
Application scenarios
High-voltage packaging: used for insulation and protection of
high-voltage equipment.
Aquarium equipment: Provide waterproof and moisture-proof sealing.
Ultrasonic atomizer: Enhance the durability and reliability of equipment.
Usage method
Mix according to the weight ratio of A:B = 5:1 and use.
Fully cure in 12-16 hours at 25℃, or 1.5-2 hours at 60-80℃.
Packing specifications
30 KG/group (Component A 25 KG/barrel, Component B 5 KG/can)
Contact Us for samples or customized solutions!
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