| Sign In | Join Free | My benadorassociates.com |
|
| Sign In | Join Free | My benadorassociates.com |
|
| Categories | CPU Thermal Pad |
|---|---|
| Brand Name: | Ziitek |
| Model Number: | TIF540-20-11U |
| Certification: | UL & RoHS |
| Place of Origin: | China |
| MOQ: | 1000pcs |
| Price: | 0.1-10 USD/PCS |
| Payment Terms: | T/T |
| Supply Ability: | 1000000 pcs/month |
| Delivery Time: | 3-5 work days |
| Packaging Details: | 24*13*12cm cartons |
| Products name: | 2.0W Thermal Insulation Silicone Soft Pad Thermal Cooling Laptop Thermal Gap Pad For Heat-Sink GPU |
| Thickness: | 1.0mmT |
| Specific Gravity: | 2.7g/cc |
| Dielectric Breakdown Voltage: | >5500 VAC |
| Thermal conductivity: | 2.0W/m-K |
| Color: | Gray |
| Operating Temp: | -40~200℃ |
| Keywords: | Thermal Gap Pad |
| Company Info. |
| Dongguan Ziitek Electronical Material and Technology Ltd. |
| Verified Supplier |
| View Contact Details |
| Product List |
2.0W Thermal Insulation Silicone Soft Pad Thermal Cooling Laptop Thermal Gap Pad For Heat-Sink GPU
Company Profile
Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
Product introduction
TIF500-20-11U thermally conductive interface materials are applied
to fill the air gaps between the heating elements and the heat
dissipation fins or the metal base.Their flexibility and elasticity
make them suited to coat very uneven surfaces.Heat can transmit to
the metal housing or dissipation plate from the heating elements or
even the entire PCB, which effecitly enhances the efficiency and
life-time of the heat-generating electronic components.
Features
> Good thermal conductive: 2.0W/mK
> Moldability for complex parts
> Soft and compressible for low stress applications
> Naturally tacky needing no further adhesive coating
> Available in varies thicknesses
Applications
> Cooling components to the chassis of frame
> CD-Rom, DVD-Rom cooling
> SAD-DC Power Adapters
> CPU
> Memory Modules
> Mass storage devices
> Mass storage devices
> Automotive electronics
> Set top boxes
> Audio and video components
> IT infrastructure
> GPS navigation and other portable devices
| Typical Properties of TIF500-20-11U Series | ||
| Property | Value | Test method |
| Color | Gray | Visual |
| Construction &Compostion | Ceramic filled silicone elastomer | *** |
| Thickness range | 1.0 mmT | ASTM D374 |
| Hardness | 27±5 Shore 00 | ASTM 2240 |
| Specific Gravity | 2.7 g/cc | ASTM D792 |
| Continuos Use Temp | -40 to 200℃ | *** |
| Dielectric Breakdown Voltage | >5500 VAC | ASTM D149 |
| Dielectric Constant | 4.5 MHz | ASTM D150 |
| Volume Resistivity | 1.0X10¹²Ohm-meter | ASTM D257 |
| Fire rating | 94 V0 | UL E331100 |
| Thermal conductivity | 2.0W/m-K | ASTM D5470 |
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Ziitek Culture
Quality :
Do it right the first time, total quality control
Effectiveness:
Work precisely and thoroughly for effectiveness
Service:
Quick response, On time delivery and Excellent service
Team work:
Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.
|
high cost-effective 2.6W/MK CPU Thermal Pad the TIF500US Outstanding thermal performance For mainboard/mother board
Ultra Soft Thermal Conductive Gap Filler 20shore00 3.5mmT For IT Infrastructure
High Performance Low Cost CPU Thermal Pad TIFT500-30-11US With Blue Color For Various Electronic Device
High performance low cost CPU thermal pad TIF500-40-11US with grey color for various electronic device
Green Color Electronic Thermal Gap Filler , Gpu Ic Chip Thermal Conductive Pad 45 Shore 00 For GPU
High Tack Surface 1.5W / MK CPU Thermal Pad For GPS navigation and other portable devices
Popular manufactured 1.5W/MK CPU Thermal Pad Outstanding thermal performance For RDRAM Memory Modules
Ultra Soft CPU Thermal Pad For Telecommunication Hardware
High Quality Heat Insulation Silicone CPU thermal pad with different thickness
China company supplied and professional CPU thermal pad TIF500-50-11S with grey color for various electronic device
