Works Under Low Pressure 25W/mK Carbon Fiber Thermal Pad For Wearable Devices

Works Under Low Pressure 25W/mK Carbon Fiber Thermal Pad For Wearable Devices

Company profile

With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

Products introduction
TS-TIR^®700-25 Series series is a high-performance carbon-based thermal pad that combines highly thermally conductive carbon fiber with polymer silicone materials. Utilizing advanced manufacturing processes to precisely distribute thermal pathways, it achievese xceptional thermal conductivity, effectively reducing interfacial thermal resistance and enhancing heat dissipation efficiency. With its ultra-thin, lightweight design and mechanical flexibility, it is suitable for 5G equipment, high-performance chips, and other high heat flux applications.

Feature

>Good thermal conductivity 25w/mK

>Ultra-low thermal resistance
>works under low pressure.

>Non-insulating material with electrical conductivity

>Non-adhesive surface

Application

>Between chips and heat dissipation modules

>5G communication equipment
>Optoelectronics industry

>wearable devices

Dongguan Ziitek Electronical Material and Technology Ltd.  provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.

Ziitek D-U-N-S® Number: 656191068