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TIF100-18-11U Silicone Thermally Conductive Gap Filler Pad Thermally Conductive Silicone Thermal Pad for High Temperature Application

Categories Thermal Pad
Brand Name: Ziitek
Model Number: TIF100-18-11U
Certification: RoHS
Place of Origin: Vietnam
MOQ: 1000pcs
Price: 0.1-10 USD/PCS
Payment Terms: T/T
Supply Ability: 100000pcs/day
Delivery Time: 3-5 work days
Packaging Details: 24*13*12cm cartons
Products name: Silicone Thermally Conductive Gap Filler Pad Thermally Conductive Silicone Thermal Pad for High Temperature Application
Hardness: 27 Shore 00
Flame rating: 94-V0
Specific Gravity: 2.5g/cc
Keywords: Thermal Gap Filler Pad
Application: Laptops, LED,Car Battery
Thermal conductivity: 1.8W/mK
Materials: Ceramic filled silicone elastomer
Color: Gray
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TIF100-18-11U Silicone Thermally Conductive Gap Filler Pad Thermally Conductive Silicone Thermal Pad for High Temperature Application

TIF100-18-11U Silicone Thermally Conductive Gap Filler Pad Thermally Conductive Silicone Thermal Pad for High Temperature Application

Product descriptions


TlF100-18-11U thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the efficiency and life-time of the heat-generating electronic components.


Features

> Good thermal conductivity: 1.8 W/mK

> Naturally tacky needing no further adhesive coating
> Soft and Compressible for low stress applications
> Available in varies thickness


Application

> Cooling components to thechassis of frame
> Set Top Box
> Car Battery & Power SupplyCharging Pile
> LED Tvi Lighting
> Graphics Card Thermal Module

Typical Properties of TIF100-18-11U Series
PropertyValueTest method
ColorGray*****
Construction &CompostionCeramic filled silicone elastomer*****
Specific Gravity2.5g/ccASTM D297
Outgassing(TML)0.55%ASTM C351
Hardness27 Shore 00ASTM 2240
Continuos Use Temp-45 to 200℃*****
Dielectric Breakdown Voltage>5500 VACASTM D149
Dielectric Constant4.5MHzASTM D150
Volume Resistivity4.0X1012 Ohm-meterASTM D257
Flame rating94 V0UL E331100
Thermal conductivity1.8W/m-KASTM D5470

Standard Thicknesses

0.020-inch to 0.200-inch (0.5mm to 5.0mm)


Product Sizes:

8" x 16"(203mm x406mm)

Individual die cut shapesand and custom thickness can be supplied.

Please contact us for confirming

Packaging Details & Lead time


The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized


Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated


Company Profile


Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!


Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL


Why Choose us ?


1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials.

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract.

5.Free sample offer.

6.Quality assurance contract.

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