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High Speed YS-666 Compound Depaneling Machine For SMT Production Line

Categories PCB Depanelizer
Brand Name: YUSH
Model Number: YS-666
Certification: CE, RUV Rheinland (China), GMC(GlobalMarket),ISO9001-2000
Place of Origin: China
MOQ: 1SET
Price: USD25000
Payment Terms: D/A,D/P,T/T,L/C
Supply Ability: 100SETS
Delivery Time: 30days
Packaging Details: woodencase
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High Speed YS-666 Compound Depaneling Machine For SMT Production Line

Introduction
1.Implement various cutting methods such as stamp perforation, V-cutting, and bridge connection.
2.movement speed:Max1000mm/s.
3. Cutting speed: Factory-set value300mm/s.
4.Dimensions:L1220mm*W1450mm*H1420mm±100MM.
5.Supports a cutting stroke of 320*420mm.
6.The cutting time is determined based on the length of the PCB board and the material of the board. (The speed
of the chisel knife: 3000 - 42000 revolutions per minute; the speed of the round knife: 10000 revolutions per
minute. 1.0 - 2.0 seconds per point.)
7.Two-tray operation, with items entering from the left and exiting from the right, in a continuous cycle.
8.Programmable control of knife path: Separate programming for flat knife cutting, separate programming for
round knife cutting, and mixed cutting programming.
9.The visual system automatically corrects the recognition of Mark points or optical points.
10.Automatic inspection and prompt function for chisels and knives. For circular knives, set a time limit (100H) for
cutting, and prompt for changing the knife
11.WIN7 operating system, data uploaded to the internal system.
12. The material of the round knife is high-speed tungsten steel.

Functional Introduction

1.Solve the cutting problems for different connection methods in the PCBA industry, such as (stamp hole
connection, V-slot connection, shorting point connection, oil stamp hole and V-slot, stamp hole and shorting
point, shorting point and V-slot) for the hybrid PCB boards.



2.Stable supporting structure and high-power high-speed spindle, with excellent cutting
performance for aluminum substrates and copper substrates.

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