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2.6W/M.K Thermal Conductive Pad Thermal Insulation Silicone Thermal Gap Pad For CPU/LED/PCB/GPU/SSD

Categories Thermal Gap Filler
Brand Name: ZIITEK
Model Number: TIF540BS
Certification: UL and RoHs
Place of Origin: China
MOQ: 1000pcs
Price: negotiation
Supply Ability: 10000/day
Delivery Time: 3-5work days
Packaging Details: 1000pcs/bag
Products name: 2.6W/M.K Thermal Conductive Pad Thermal Insulation Silicone Pad Thermal Gap Pad For CPU/LED/PCB/GPU/SSD
Continuos Use Temp: -45℃ to 200℃
Keywords: Thermal Gap Pad
Density: 3.0g/cc
Hardness: 13 Shore 00
Color: Blue
Thermal conductivity& Compostion: 2.6W/m-K
Thickness: 1.0mmT
Construction: Ceramic filled silicone elastomer
Application: CPU/LED/PCB/GPU/SSD
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2.6W/M.K Thermal Conductive Pad Thermal Insulation Silicone Thermal Gap Pad For CPU/LED/PCB/GPU/SSD

2.6W/M.K Thermal Conductive Pad Thermal Insulation Silicone Pad Thermal Gap Pad For CPU/LED/PCB/GPU/SSD


TIFTM540BS use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.


Features:

> Good thermal conductive : 2.6W/mK
> Naturally tacky needing no further adhesive coating

> Soft and Compressible for low stress applications
> Fiberglass reinforced for puncture, shear and tear resistance
> Easy release construction
> Electrically isolating


Applications
> Cooling components to the
> chassis of frame
> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices
> Monitoring the Power Box
> AD-DC Power Adapters
> Rainproof LED Power
> Waterproof LED Power
> SMD LED module
> LED Flesible strip, LED bar
> LED Panel Light

Typical Properties of TIFTM540BS
ColorBlueVisual
Construction & CompostionCeramic filled silicone elastomer*******
Density3.0g/ccASTM D297
Thickness range1.0mmTASTM C351
Hardness13 Shore 00ASTM 2240
Dielectric Breakdown Voltage>5500 VACASTM D412
Operating Temp-45 ~200℃*******
Dielectric Constant5.0 MHzASTM D150
Volume Resistivity≥2.0X1013Ohm-meterASTM D257
Fire rating94 V0equivalent UL
Thermal conductivity2.6W/mKASTM D5470

Product Specifications
Standard Thickness:

0.02 to 0.20 (0.50 to 5.00 mm) with increments of 0.01 (0.25 mm).


Standard Size:

8"X16"(203 mm×406 mm).


Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment). DC1 (Single-sided hardening).

Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).
Notes: FG (Fiberglass)provides enhanced strength, suitable for materials with thicknesses of 0.01 to 0.02 inch (0.25 to 0.50 mm).
The TIF series is available in custom shapes and various forms.

For other thicknesses or moreinformation. please contact us.

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized


Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated


Company Profile

With professional R&D capabilities and many year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.


FAQ:

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

Q: How long is your delivery time?

A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.

Q: Do you provide samples ? is it free or extra cost?

A: Yes, we could offer samples free of charge.

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