TIF040-12 Heat Sink Thermally Conductive Gel Adhesive Injector Cpu Gpu

TIF040-12 Heat Sink Thermally Conductive Gel Adhesive Injector Cpu Gpu​

TIF^®040-12 is a soft silicone gel-based gap filer pad, formulated with a special blend of filers to provide both excellent thermal conductivity and superior softness. Compared to conventional thermal greases, TIF^®040-12 has a higher viscosity, which effectively prevents filler separation from the silicone matrix and reduces filler migration, helping maintain consistent thermal performance. It is applied in a similar manner to thermal grease and is suitable for commercial dispensing or automated equipment. Typical applications include flip-chip microprocessors, PPGAs, micro BGA packages, BGA packages, DSP chips, circular Isilicon chips, LED lighting, and other high-power electronic components.

Application

> Heat-sink & frame
> LED backlight module,LED lighting
> High speed hardware driver
> Micro heat pipe
> Vihicel enginee controller
> Telecom industry
> Semiconductor automatic laboratory equipment

Công ty Công nghệ Ziitek Việt Nam is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.