Sign In | Join Free | My benadorassociates.com
benadorassociates.com
Products
Search by Category
Home >

TIF500 Thermal Pad 2.6W/MK Silicon Thermal Gap Pad Filling For Auditioning Electronic Products

Categories Thermal Pad
Brand Name: Ziitek
Model Number: TIF500 Series
Certification: RoHS
Place of Origin: Vietnam
MOQ: 1000pcs
Price: 0.1-10 USD/PCS
Payment Terms: T/T
Supply Ability: 100000pcs/day
Delivery Time: 3-5 work days
Packaging Details: 24*13*12cm cartons
Products name: TIF500 Thermal Pad 2.6W/MK Silicon Thermal Gap Pad Filling For Auditioning Electronic Products
Keywords: Thermal Pad
Hardness: 35 Shore 00
Color: Violet
Thermal conductivity: 2.6W/mK
Application: Auditioning Electronic Products
Specific Gravity: 2.95g/cc
Flame rating: 94-V0
Sample: Sample free
Materials: Ceramic filled silicone elastomer
  • Haven't found right suppliers
  • Our buyer assistants can help you find the most suitable, 100% reliable suppliers from China.
  • And this service is free of charge.
  • we have buyer assistants who speak English, French, Spanish......and we are ready to help you anytime!
Submit Buying Request
  • Product Details
  • Company Profile

TIF500 Thermal Pad 2.6W/MK Silicon Thermal Gap Pad Filling For Auditioning Electronic Products

TIF®500 Thermal Pad 2.6W/MK Silicon Thermal Gap Pad Filling For Auditioning Electronic Products

Product descriptions


TlF®500 series is an extremely soft gap filling material rated at a thermal conductivity of 2.6W/m-K. It is specially formulated for high performance applications requiring low assembly stress. The material offers exceptional thermal performance at low pressures due to the unique filler package and ultra low modulus resin formulation. Ziitek TIF®500 is highly conformal to rough or irregular surfaces, allowing excellent wet-out at the interface. Protective liners are supplied on both sides allowing for ease of use.


Features

> Good thermal conductive 2.6W/mK
> Moldability for complex parts
> Soft and compressible for low stress applications
> Broad range of hardnesses available
> Moldability for complex parts
> Outstanding thermal performance


Application

> Mainboard/mother board
> Notebook
> Power supply
> CPU
> Micro heat pipe thermal solutions
> Telecommunication hardware
> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules


Typical Properties of TIF®500 Series
PropertyValueTest method
ColorViolet*****
Construction &CompostionCeramic filled silicone elastomer*****
Specific Gravity2.95g/ccASTM D297
Thickness range0.020"(0.50mm)~0.200"(5.0mm)ASTM D374
Hardness35 Shore 00ASTM 2240
Continuos Use Temp-45 to 200℃*****
Dielectric Breakdown Voltage>5500 VACASTM D149
Dielectric Constant5.0 MHzASTM D150
Volume Resistivity5.3X10¹² Ohm-meterASTM D257
Flame rating94 V0UL E331100
Thermal conductivity2.6W/m-KASTM D5470

Standard Thicknesses

0.020-inch to 0.200-inch (0.5mm to 5.0mm)


Product Sizes:

8" x 16"(203mm x406mm)

Individual die cut shapesand and custom thickness can be supplied.

Please contact us for confirming

Packaging Details & Lead time


The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized


Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated


Company Profile


Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!


Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL


Why Choose us ?


1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract

5.Free sample offer

6.Quality assurance contract .

Buy TIF500 Thermal Pad 2.6W/MK Silicon Thermal Gap Pad Filling For Auditioning Electronic Products at wholesale prices
Send your message to this supplier
 
*From:
*To: CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
*Subject:
*Message:
Characters Remaining: (0/3000)
 
Inquiry Cart 0