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High Thermal Conductive Carbon Fibre Based Thermal Pad For 5G Communication Equipment

Categories Thermal Graphite Sheet
Brand Name: Ziitek
Model Number: TS-TIR700-09
Certification: RoHS
Place of Origin: China
MOQ: 1000pcs
Price: 0.1-10USD/pcs
Payment Terms: T/T
Supply Ability: 100000pcs/month
Delivery Time: 3-8 work days
Packaging Details: 24*13*12cm cartons
Products Name: High Thermal Conductive Carbon Fibre Based Thermal Pad For 5G Communication Equipment
keywords: Thermal Pad
Feature: Ultra-low thermal resistance
Thermal conductiivity: 9W/m-K
Color: Gray
Hardness: 55±10 Shore 00
Material: carbon fiber filled silicone
Density: 2.1g/cc
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  • Product Details
  • Company Profile

High Thermal Conductive Carbon Fibre Based Thermal Pad For 5G Communication Equipment

High Thermal Conductive Carbon Fibre Based Thermal Pad For 5G Communication Equipment

Company profile


Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad and heat-conducting grease, heat-conducting plastic, silicone rubber, silicone rubber foam, etc. We adhere to the business philosophy of "survival by quality, development by quality", and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation.


Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL


Products introduction
TS-TIR®700-09 Series series is a high-performance carbon-based thermal pad that combines highly thermally conductive carbon fiber with polymer silicone materials. Utilizing advanced manufacturing processes to precisely distribute thermal pathways, it achievese xceptional thermal conductivity, effectively reducing interfacial thermal resistance and enhancing heat dissipation efficiency. With its ultra-thin, lightweight design and mechanical flexibility, it is suitable for 5G equipment, high-performance chips, and other high heat flux applications.


Feature

>Good thermal conductivity 9w/mK

>Ultra-low thermal resistance
>works under low pressure.

>Non-insulating material

>Non-adhesive surface


Application

>Between chips and heat dissipation modules

>5G communication equipment
>Optoelectronics industry

>wearable devices

Typical Properties of TIR®700-09 series
Product NameTIR®700-09Test Method
ColourGrayVisual
ConstructionCarbon fiber filled silicone*****
Thickness range0.04"~0.20"(1.0~5.0 mm)ASTM D374
Hardness55±10 Shore 00ASTM D2240
Density2.1 g/cm3ASTM D792
Operation Temperature-40℃~ 200℃******
Thermal impedance9.0W/m-KASTM D5470
Specific heat capacity (J/g ℃)0.93ASTM E1269 @25℃
Flame RatingV-0UL94
RoHSCompliantIEC62321

Product Specification
Standard Thickness:0.04" (1.0mm), 0.06" (1.5mm),0.08" (2.0mm),0.10" (2.5mm),0.12" (3.0mm)

Standard Size: 1.97”x 1.97”(50.0mm x 50.0mm)

Packaging Details & Lead time

1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated


Ziitek Culture


Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

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