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6.0W High Performance Self-Adhesive Thermal Gap Filler Pad Thermal Conductive Silicone Pad For LED CPU GPU EV Battery

Categories Thermal Gap Filler
Brand Name: ZIITEK
Model Number: TIF100C 6050-11
Certification: UL and RoHs
Place of Origin: China
MOQ: 1000pcs
Price: negotiation
Supply Ability: 10000/day
Delivery Time: 3-5work days
Packaging Details: 1000pcs/bag
Products name: 6.0W High Performance Self-Adhesive Thermal Gap Filler Pad Thermal Conductive Silicone Pad For LED CPU GPU EV Battery
Keywords: Thermal Gap Filler
Color: Gray
Thermal conductivity& Compostion: 6.0W/m-K
Specific Gravity: 3.3g/cc
Thickness: 0.012"(0.30mm)~0.200"(5.00mm)
Construction: Ceramic filled silicone elastomer
Continuos Use Temp: -45℃ to 200℃
Application: LED CPU GPU EV Battery
Hardness: 50 Shore 00
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6.0W High Performance Self-Adhesive Thermal Gap Filler Pad Thermal Conductive Silicone Pad For LED CPU GPU EV Battery

6.0W High Performance Self-Adhesive Thermal Gap Filler Pad Thermal Conductive Silicone Pad For LED CPU GPU EV Battery


TS-TIF®100C 6050-11 series is a silicone-based thermal material designed to fill the gaps between heat-generating components and liquid cooling plates or metal bases. lts flexibility and elasticity make it ideal for covering highly uneven surfaces. With excellent thermal conductivity, it efficiently transfers heat from heat-generating elements or PCBs to liquid cooling plates or metal heat dissipation structures,thereby improving the cooling efficiency of high-power electronic components and extending the lifespan of the equipment.


Features:


>Excellent thermal conductivity6.0W/mK

>Self-adhesive without the need for additional surface adhesive
>Highly compressible, soft, and elastic

>Available in various thicknesses
>Good chemical stability


Applications:


>CPU and GPU processors and other chipsets
>High-performance computing (HPC)

>Industrial equipment
>Network communication devices

>New energy vehicles

Typical Properties of TS-TIF®100C 6050-11 Series
ColorGrayVisual
Construction & CompostionCeramic filled silicone elastomer******
Specific Gravity3.3g/ccASTM D297
thickness0.012"(0.30mm)~0.200"(5.00mm)ASTM D374
Hardness (thickness<1.0mm)50 (Shore 00)ASTM 2240
Continuos Use Temp-45 to 200℃******
Dielectric Breakdown Voltage>5500 VACASTM D149
Dielectric Constant7.0MHzASTM D150
Volume Resistivity≥1.0X10¹²Ohm-meterASTM D257
Fire rating94 V0equivalent UL
Thermal conductivity6.0W/m-KASTM D5470

Standard Thicknesses:


0.020" (0.51mm) 0.030" (0.76mm)

0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)

0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)

0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)

0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)

0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)

0.190" (4.83mm) 0.200" (5.08mm)

Consult the factory to alternate thickness.


Product Specification
Product Thicknesses: 0.012"(0.30mm)-0.200"(5.00mm)
Product Sizes:8" x 16"(203mm x406mm)
Custom die-cut shapes and thicknesses are available.Please contact us for details.
Store in a cool, dry place, away from fire and sunlight.
Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized


Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated


Company Profile

Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad and heat-conducting grease, heat-conducting plastic, silicone rubber, silicone rubber foam, etc. We adhere to the business philosophy of "survival by quality, development by quality", and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation.


Independent R&D team


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