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Thermal Conductive Silicone Pad 8.0 W/M-K High-Temperature Insulation Gap Pad GPU Laptop Thermal Conductive Pad

Categories Thermal Gap Filler
Brand Name: ZIITEK
Model Number: TS-TIF100C 8045-11
Certification: UL and RoHs
Place of Origin: China
MOQ: 1000pcs
Price: negotiation
Supply Ability: 10000/day
Delivery Time: 3-5work days
Packaging Details: 1000pcs/bag
Products name: Thermal Conductive Silicone Pad 8.0 W/M-K High-Temperature Insulation Gap Pad GPU Laptop Thermal Conductive Pad
Keywords: Thermal Conductive Silicone Pad
Hardness: 45 Shore 00
Color: Gray
Specific Gravity: 3.4g/cc
Thickness: 0.012"(0.30mm)~0.200"(5.00mm)
Construction: Ceramic filled silicone elastomer
Continuos Use Temp: -45℃ to 200℃
Thermal conductivity& Compostion: 8.0W/m-K
Application: GPU Laptop
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Thermal Conductive Silicone Pad 8.0 W/M-K High-Temperature Insulation Gap Pad GPU Laptop Thermal Conductive Pad

Thermal Conductive Silicone Pad 8.0 W/M-K High-Temperature Insulation Gap Pad GPU Laptop Thermal Conductive Pad


TS-TIF®100C 8045-11 series is a silicone-based thermal material designed to fill the gaps between heat-generating components and liquid cooling plates or metal bases. lts flexibility and elasticity make it ideal for covering highly uneven surfaces. With excellent thermal conductivity, it efficiently transfers heat from heat-generating elements or PCBs to liquid cooling plates or metal heat dissipation structures,thereby improving the cooling efficiency of high-power electronic components and extending the lifespan of the equipment.


Features:
> Excellent thermal conductivity 8.0W/mK

> Moldability for complex parts
> Soft and compressible for low stress applications
> Broad range of hardnesses available
> BMoldability for complex parts
> BOutstanding thermal performance


Applications:

> Telecommunication hardware
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units

> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> CPU

> Display card
> Mainboard/mother board
> Notebook
> Power supply

Typical Properties of TS-TIF®100C 8045-11 Series
ColorGrayVisual
Construction & CompostionCeramic filled silicone elastomer******
Specific Gravity3.4g/ccASTM D297
thickness0.012"(0.30mm)~0.200"(5.00mm)ASTM D374
Hardness (thickness<1.0mm)45 (Shore 00)ASTM 2240
Continuos Use Temp-40 to 200℃******
Dielectric Breakdown Voltage>5500 VACASTM D149
Dielectric Constant7.2MHzASTM D150
Volume Resistivity≥1.0X10¹²Ohm-meterASTM D257
Fire rating94 V0equivalent UL
Thermal conductivity8.0W/m-KASTM D5470

Standard Thicknesses:


0.020" (0.51mm) 0.030" (0.76mm)

0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)

0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)

0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)

0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)

0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)

0.190" (4.83mm) 0.200" (5.08mm)

Consult the factory to alternate thickness.


Product Specification
Product Thicknesses: 0.012"(0.30mm)-0.200"(5.00mm)
Product Sizes:8" x 16"(203mm x406mm)
Custom die-cut shapes and thicknesses are available.Please contact us for details.
Store in a cool, dry place, away from fire and sunlight.
Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized


Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated


Company Profile

Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.


Independent R&D team


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