Automated Precision Dicing Machine​
​High-Performance Solutions for Semiconductor, Electronics, and Precision Manufacturing

The Automated Precision Dicing Machine is designed for ultra-precision cutting of brittle materials such as semiconductors, ceramics, glass, and composites. Engineered with dual-spindle technology, multi-axis control, and fully automated systems, this machine delivers unmatched accuracy and efficiency for applications like wafer dicing, FPC flexible board cutting, and micro-component processing.

​Key Applications:

• Semiconductor wafer slicing
• Ceramic substrate division
• Medical device manufacturing
• Automotive electronics
• Optical component processing

​Core Advantages:

• Dual-spindle configuration for flexible power options (1.2/1.8/2.4/3.0 kW) and ultra-high-speed cutting (up to 60,000 RPM).
• Multi-axis synchronization (Y1/Y2, X, Z1/Z2, O axes) ensures sub-micron precision and complex geometry handling.
• Fully automated cleaning system for zero-defect production.

Technical Specifications

Performance & Quality of Dicing Machine

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Precision Engineering​

• Achieves ​​±0.0001 mm repeatability​ on Y1/Y2 axes and ​​±0.002 mm on Z1/Z2 axes, ensuring consistent edge quality with minimal chipping or micro-cracks.
• Advanced vision systems and force feedback adapt to material deformation and tool wear.

​Speed & Efficiency​

• High-speed spindle (60,000 RPM) combined with 310 mm/s linear axis movement maximizes throughput without compromising accuracy.
• Automated loading/unloading and cleaning reduce cycle time by 30%.

​Durability​

• Robust construction with vibration-resistant design ensures 24/7 operation.
• Spindle life optimized for 8,000+ hours under continuous use.

Application

• Semiconductor: Wafer dicing for chips down to 50μm thickness.
• ​Medical Devices: Precision cutting of bio-compatible materials (e.g., alumina ceramics).
• ​Automotive: Flexible PCB and sensor component singulation.

ZMSH Automated Precision Dicing Machine

Frequently Asked Questions (FAQ)

​Q: What materials can this machine handle?​​
A: It’s designed for cutting brittle materials like semiconductors, ceramics, glass, and composites. Common uses include slicing wafers, processing flexible printed circuits (FPC), and precision components for electronics or medical devices.

Q: How precise is the machine?​​
A: It achieves extremely fine cuts with accuracy down to ​0.0001 mm​ (thinner than a human hair). This ensures clean edges with minimal chipping, even for delicate materials.

Q: What power does it need?​​
A: It runs on standard ​3-phase 380V power​ (common in industrial settings). The dual-spindle system adapts to different materials by adjusting power output.

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