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Rigid PCB Hot Press Cushion Laminated Pad With High Temperature Resistant & Reusable Lamination Buffer Pad

Rigid PCB Hot Press Cushion Laminated Pad With High Temperature Resistant & Reusable Lamination Buffer Pad

Rigid PCB Hot Press Cushion Laminated Pad With High Temperature Resistant & Reusable Lamination Buffer Pad
Rigid PCB Hot Press Cushion Laminated Pad With High Temperature Resistant & Reusable Lamination Buffer Pad
Categories Laminated Pad
Model Number: MKCP-PCB-G2
Thickness Tolerance: ±0.3mm
Place of Origin: China
MOQ: 50pcs
Price: Negotiable
Packaging Details: Strong plywood package with proper soft protection material inside, suitable for long distance for sea or air transport
Reusable Times: 300–500 repeated lamination & pressing cycles
Supply Ability: 10000 Square Meters per Month
Performance: compression and expansion coefficient
Water Absorption: 3%–8%
Payment Terms: L/C, D/A, D/P, T/T, Western Union
Physical Properties: High flatness, wear resistance and tear resistance, stable thickness variation rate
Delivery Time: 10-20 working days
Feature: Long-term stable operation under ≤280℃
Brand Name: MK
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Company Info.
MKarte Material Technology (Tianjin) Limited
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Rigid PCB Hot Press Cushion Laminated Pad With High Temperature Resistant & Reusable Lamination Buffer Pad

Rigid PCB Hot Press Cushion Laminated Pad
High-performance red rigid buffer pad designed for rigid PCB hot lamination processes, featuring high temperature resistance and reusability.
Product Overview
MKCP-PCB-G2 Rigid PCB Cushion Pad is engineered to replace traditional hot-press kraft paper, delivering superior dimensional stability, uniform heat conduction, and consistent cushioning effect. Suitable for both manual and automatic PCB lamination production lines, this reusable pad significantly improves PCB lamination yield and production efficiency while reducing comprehensive material costs by over 20%.
Application Specifications
  • Top & Bottom Cushion Pad: 4.0-6.5mm thickness for outermost layers of lamination stacks
  • Middle Layer Cushion Pad: 1.5-2.0mm thickness for uniform intermediate buffering between PCB layers
Key Features & Benefits
  • 300-500 repeated lamination cycles for significant production cost reduction
  • Superior performance in flatness, wear resistance, and dimensional stability compared to kraft paper
  • High temperature resistance up to 280℃ without carbonization or brittleness
  • Excellent buffering effect and thermal conductivity with stable compression and expansion coefficients
  • Flame retardant, non-toxic, odorless, dust-free with good breathability
Product Structure
Multi-layer construction includes: Nano high temperature resistant coating, fiberglass cloth, high molecular weight polymer, tensile tear layer, polymer aggregates, and additional fiberglass cloth with protective coating.
Performance Specifications
Core ItemProduct Performance & Features
Reusable Times300-500 repeated lamination & pressing cycles, ultra-low consumption cost
High Temperature ResistanceLong-term stable operation under ≤280℃, no carbonization or brittleness
Buffering & Thermal PerformanceExcellent cushioning & thermal conductivity, stable compression and expansion coefficient
Physical PropertiesHigh flatness, wear resistance and tear resistance, stable thickness variation rate
Safety & Environmental ProtectionFlame retardant, non-toxic, odorless, dust-free and breathable
Cost AdvantageSingle pad replaces multiple kraft paper layers, saving over 20% production cost
Technical Parameters
  1. Service life: 300-500 cycles
  2. High temperature resistance: ≤280℃
  3. Thickness: 4mm-6.5mm (top/bottom pad) / 1.5-2.0mm (middle layer pad)
  4. Thickness tolerance: ±0.3mm
  5. Standard sizes: 1500×1300mm, 1300×780mm, 1170×690mm, and various inch dimensions
  6. Size tolerance: ±2mm
  7. Tensile strength: ≥ 25 MPa
  8. Buffer standard: ≥ 12%
  9. Water absorption: < 8% (3-8%)
Compared with traditional hot-press kraft paper, MKCP-PCB-G2 cushion pad achieves more stable lamination quality, lower replacement frequency and higher production efficiency, making it essential for standardized and high-precision rigid PCB lamination production.
Rigid PCB Hot Press Cushion Pad technical specifications and application FPC Cushion Pad technical specifications and application diagram
Product Tags:

Rigid PCB laminated pad

  

High temperature resistant lamination buffer pad

  

Reusable PCB hot press cushion

  
Buy Rigid PCB Hot Press Cushion Laminated Pad With High Temperature Resistant & Reusable Lamination Buffer Pad at wholesale prices

Rigid PCB Hot Press Cushion Laminated Pad With High Temperature Resistant & Reusable Lamination Buffer Pad

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