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Direct Bonded Copper Ceramic Substrate

Categories Technical Ceramic Parts
Brand Name: ZG
Model Number: MS
Certification: CE
Place of Origin: China
MOQ: 1 PC
Price: 10USD/PC
Payment Terms: L/C, D/A, D/P, T/T, Western Union, MoneyGram
Supply Ability: 1000 PCS
Delivery Time: 5-8 work days
Packaging Details: Strong wooden box for Global shipping
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Direct Bonded Copper Ceramic Substrate

Direct Bonded Copper Ceramic Substrate

DBC ceramic substrate, short for "direct bonded copper ceramic substrate," is an advanced material consisting of a ceramic substrate (usually Al2O3 or AlN) and copper tightly bonded together through a hypoeutectic process. This unique combination of materials produces a substrate with exceptional thermal conductivity, low thermal expansion, high strength, and excellent wettability for soldering.


Material properties of direct bonded copper-ceramic substrates


  • Low thermal expansion

  • High strength

  • High thermal conductivity

  • High solder wettability

Applications of direct bonded copper-ceramic substrates


  • Power electronics: IGBT, MOSFET, thyristor module, solid-state relay, diode, power transistors
  • Automotive: ABS, power steering, DC/DC converter, LED lighting, ignition control system
  • Household appliances: air conditioner, Peltier cooler
  • Environmental technologies: Local power generation, electric vehicles, traction control systems, photovoltaic units, wind energy
  • Industry: LED displays, welding machines
  • Aerospace: laser, power source for satellites and aircraft
  • PC/IT: power supply, UPS system
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