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| Categories | Memory Connectors |
|---|---|
| Packaging Details: | SMD |
| Card Type: | MicroSIM Card |
| MOQ: | 1000 |
| Model Number: | MIS22-S1F1-2000-A |
| Delivery Time: | 3-5工作日 |
| Operating Temperature: | -25℃~+85℃ |
| Stock: | 100000 |
| Brand Name: | MIS22-S1F1-2000-A |
| Description: | -25℃~+85℃ Push-Push 1.35mm MicroSIM Card SMD PC Card Sockets RoHS |
| Card Connection Mode: | Push-Push |
| Height Above Board: | 1.35mm |
| Company Info. |
| Shenzhen ECER Network Technology Co., Ltd. |
| Verified Supplier |
| View Contact Details |
| Product List |
This specification covers performance, tests, and quality requirements for SIM Memory Card Connectors. These connectors provide space savings and improved functionality for system signal transfer.
Applications: SIM Card Connectors
| Part No. | Description | Rating Current | Contact Resistance | Dielectric Withstanding | Insulation Resistance | Mating Cycle | Operating Temperature | Material - Housing | Material - Contact | Material - Shell | Finish - Contact Area | Finish - Solder Tails |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| MIS22-S1F1-2000-A( CD) | MICOR SIM PUSN Card Holder (6+1P with CD) | 0.5A MAX. | 50 m MAX | 500V AC MIN. | 1000 M MIN. | 3000 CYCLES | -25 TO +85 | LCP S475 UL 94V-0 | C5191 | SUS304-H | GOLD FLASH PLATED | GOLD FLASH PLATED |
| MIS11-S1F1-2000-A( CD) | MICOR SIM PUSN Card Holder (6P without CD) | 0.5A MAX. | 50 m MAX | 500V AC MIN. | 1000 M MIN. | 3000 CYCLES | -25 TO +85 | LCP S475 UL 94V-0 | C5191 | SUS304-H | GOLD FLASH PLATED | GOLD FLASH PLATED |
| Test Description | Requirement | Condition |
|---|---|---|
| Low-Signal Level Contact Resistance | R<100 m | Apply DC 50010% Volts between adjacent contacts of mated connectors for one minute. MIL-STD-202F, Method 302 |
| Insulation Resistance | R>1000 M | Apply DC 50010% Volts between adjacent contacts of mated connectors for one minute. MIL-STD-202F, Method 302 |
| Dielectric Withstanding Voltage | No discharge, flashover or breakdown. | 500 V initial and 250 V final for 1 minute. MIL-STD-202F, Method 301 |
| Retention Force | 100 Gram (0.98N) minimum (per pin) | Mate connector with a suitable gauge for each pin at rate of 25 mm/min. MIL-STD-1344A, Method 2012.1 |
| Vibration | Discontinuity 1.0 microsec. MAX | Mate dummy card and subject to Vibration conditions for 2 hours in each of 3 axes. Amplitude: 1.52 mm P-P, Frequency: 10-55-10 Hz. MIL STD 202 Method 201 |
| Durability | 5000 cycles. | The sample should be mounted in the at the rate of 25mm/min. MIL-STD-1344A, Method 2016 |
| Solderability | Solderable area shall have minimum of 95% solder coverage. | Subject the test area of contacts into flux for 30.5 seconds and then into solder bath, controlled at 2705, for 30.5 seconds. |
| Salt Spray | Oxidation of not more than 5% | Subject mated/unmated connectors to 51% salt-solution concentration, 352 for 24 hours. MTL-STD-1344A, Method 1001.1 |
| Temperature Life (Heat Aging) | A. Products in 852 96 hours, the product can still be used normally. B. Products in 2605 or eight of the reflow temperature (maximum temperature of 260), the deformation of not more than 0.08 mm. | MTL-STD-202F, Method 108A |
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