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SHETIME TFW11-S1F1-2000-A

Categories Memory Connectors
Model Number: TFW11-S1F1-2000-A
Card Detection: Yes
Height Above Board: 2mm
Packaging Details: SMD
Delivery Time: 3-5工作日
Card Type: MicroSD Card (TF Card)
Brand Name: TFW11-S1F1-2000-A
Supplementary Features: With Locating Pins
Stock: 100000
Card Connection Mode: Push-Push
Description: Push-Push 2mm Connector and Ejector MicroSD Card (TF Card) SMD PC Card Sockets RoHS
MOQ: 1000
Connector Type: Connector and Ejector
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SHETIME TFW11-S1F1-2000-A

Product Overview

This product specification defines the product performance and the test methods to ascertain the performance of the T-FLASH., which is designed and manufactured by Company. The T-FLASH connector is a type of external welding T-Flash connector.

Key Features:

  • Designed for T-Flash external welding applications.
  • Conforms to various international test standards (MIL-STD, EIA, JIS, IEC, UL, EN).
  • Materials comply with RoHS directive.
  • Suitable for SMT and Infrared Reflow soldering processes.
  • Resistant to cleaning processes.

Brand

(Twshetime)

Origin

Taiwan Factory: , China Factory:

Customer


Customer P/N

TFW1X-XXXX-X000-A

Product Name

T-Flash type CONN.

Part Number Example

TFW11-N1S1-2000-A

Housing Material

LCP UL94-V0

Contact Material

Copper Alloy

Shell Material

SUS201

Electroplating Specifications

Nickel Underlayer: 40u" MIN, Contact Area Gold: 0.5u" MIN, Solder Leg Area Matte Tin: 80u" MIN.

Plating Details

Contact: Gold Flash Plated. Shell: Nickel Plated.

Certifications

RoHS compliant materials, UL498 standard.

Packaging

Packaged according to customer specified requirements, typically in tray or carrier tape. Specifics per purchase order and customer drawing.

Marking

Manufacturers name, industry recognized logo, or customer approved marks.

Storage Conditions

Temperature: -25 to +85, Relative humidity: 80%, Not to store in corrosive environments. Re-qualification test required if storage exceeds 6 months.

ItemRequirementsTest MethodsInitialAfter DurabilityAfter Environmental
Contact resistance (Low Level)80 m Max.Subject mated contacts assembled in housing to closed circuit of 10 mA max. at open circuit voltage of 20 mV max.80 m--
Insulation resistance1000 M Min.Measure by applying test potential between the adjacent contacts, and between the contacts and ground in the mated connector. MIL-STD-202, Method 302, Condition B (500 V DC10%).1000 M--
Dielectric Strength500 V AC for 1 minute.Connector must withstand test potential.---
Electrical CharacteristicsValueUnitNotes
Contact Current Rating0.5A MAX-
Contact Resistance100m MAX-
Insulation Resistance500M MIN-
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