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Durable JEDEC IC Trays For Semiconductor Clean Protection

Categories JEDEC IC Trays
MOQ: 500
Delivery Time: 10 workdays
Incoterms: EXW, FOB, CIF, DDU, DDP
Clean Class: General And Ultrasonic Cleaning
Payment Terms: T/T
Reusable: Yes
Flatness: Less than 0.76mm
Model Number: HN25068
Color: Black
Price: $1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities)
Mold Type: Injection
Capacity: 13x5=65 PCS
Certification: ROHS, ISO
Quality Assurance: Delivery Guarantee, Reliable Quality
Supply Ability: 2000PCS/Day
Tray Shape: Rectangular
Packing Level: Transport package
Brand Name: Hiner-pack
Tray Weight: Varies, Typically Up To 500 Grams Per Cavity
Packaging Details: CARTON, PALLET
Ic Type: BGA,QFP,QFN,LGA,PGA
Place of Origin: China
Cavity Size: 19.45×22.42 mm
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Durable JEDEC IC Trays For Semiconductor Clean Protection

Durable JEDEC IC Trays For Semiconductor Clean Protection

Offer rigid grid cavity structures to firmly lock semiconductor chips in place. Prevent component shift and collision across test transfer and storage cycles. Seek reliable component holding solutions for production lines? Stand heavy‑duty repeated operations to cut chip damage risk.


Provide stable anti‑static performance to shield sensitive semiconductors from static harm. Keep chip surfaces clean throughout whole handling workflows. Stand consistent performance under long‑run clean‑room manufacturing conditions.


Support full custom cavity size depth and layout adjustments. Match diverse chip dimension requirements. Adapt automated pick‑and‑place equipment and multiple production scenarios to satisfy varied semiconductor manufacturing demands.

Key Features/ Benefits
  • RoHS compliant materials
  • Reliable ESD anti‑static protection
  • Rigid grid cavity structure
  • Secure component retention
  • JEDEC standard compliance
Specifications
BrandHiner-pack
ModelHN25068
MaterialPC
Package TypeJEDEC
ColorBlack
Resistance1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size322.6×135.9×7.62 mm
Cavity Size19.45×22.42 mm
Matrix QTY13x5=65 PCS
WarpageMAX 0.76mm
ServiceAccept OEM, ODM
Custom Pocket OptionsAvailable
Applications

Fit semiconductor chip storage, production transfer and component testing. Work well with automated pick‑and‑place equipment and clean‑room environments. Serve short‑term placement and long‑term chip safekeeping.


Apply widely for semiconductor factories IC packaging workshops and component warehouses. Support on‑site production cross‑workshop transfer and high‑precision component preservation work.

Packaging & Shipping/ Services
Wrap each tray with anti‑static film for full ESD protection. Pack inside anti‑static cartons with foam padding against impact damage. Support pallet stacking for bulk orders. Supply sea air and express shipping with full order tracking for intact on‑time arrival.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

  • Rich experience in JEDEC / IC / Waffle Pack Trays
  • In-house mold design capability
  • Fast prototype development
  • Strict QC process
  • Stable supply for global semiconductor customers
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