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| Categories | JEDEC IC Trays |
|---|---|
| Model Number: | HN25083 |
| Reusable: | Yes |
| Packing Level: | Transport package |
| Flatness: | Less than 0.76mm |
| Capacity: | 20x5=100 PCS |
| Price: | $1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities) |
| Quality Assurance: | Delivery Guarantee, Reliable Quality |
| Certification: | ROHS, ISO |
| MOQ: | 500 |
| Delivery Time: | 10 workdays |
| Mold Type: | Injection |
| Payment Terms: | T/T |
| Color: | Black |
| Incoterms: | EXW, FOB, CIF, DDU, DDP |
| Cavity Size: | 18.5×11.6×4.26 mm |
| Place of Origin: | China |
| Ic Type: | BGA,QFP,QFN,LGA,PGA |
| Supply Ability: | 2000PCS/Day |
| Tray Weight: | Varies, Typically Up To 500 Grams Per Cavity |
| Packaging Details: | CARTON, PALLET |
| Clean Class: | General And Ultrasonic Cleaning |
| Brand Name: | Hiner-pack |
| Tray Shape: | Rectangular |
| Company Info. |
| Shenzhen Hiner Technology Co., Ltd. |
| Verified Supplier |
| View Contact Details |
| Product List |
Constructed from high‑performance Mppo material, hold integrated circuit parts securely. Resist high operating heat and block outside contaminants. Maintain stable performance through repeated circulation inside semiconductor workshops.
Meet diverse chip layout requirements. Custom cavity development serves as core offering. Adjust cavity dimension, slot quantity and overall tray outline to match varied chip samples and project standards.
Fit mainstream semiconductor production workflows. Keep steady supporting performance for long‑time mass‑use. Bring consistent protection from component loading all the way to finished‑part outgoing shipment.
| Brand | Hiner-pack | ||
| Material | MPPO | ||
| Color | Black | ||
| Outline Line Size | 322.6×135.9×9.5 mm | ||
| Matrix QTY | 20x5=100 PCS | ||
| Service | Accept OEM, ODM | ||
Suit semiconductor chip packaging and assembly workflows. Hold integrated circuit components steady during automated production operations.
Fit bulk component storage and inter‑workshop transit. Protect delicate chips against dust and scratch. Accept custom modification for special non‑standard chip types.
Get stacked with separating protective boards, then packed into thick carton cases. Lower scratch and collision risks during inner‑site handling.
Support sea, air and express delivery modes. Arrange stable production lead‑time. Adopt reinforced outer package to reduce damage risk for long‑distance overseas shipment.
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