RGB Rolling Shutter USB 2.0 Camera Module 96 Perspective 8.29 MP With IMX415 Sensor

8.3MP RGB Rolling Shutter 96 Perspective USB 2.0 Camera Module With IMX415 Sensor , Customization Services Available .

1.Basic Parameters:

- Resolution: 3840 (H) × 2160 (V), 8.29 MP; compatible with mainstream resolutions for backward compatibility, meeting both high-definition imaging and multi-frame-rate output requirements.
- Pixel dimensions: 1.45 μm (H) × 1.45 μm (V), effectively enhancing light intake per pixel while balancing image resolution with low-light sensitivity.
- Optical format: 1/2.8-inch, compact and lightweight, designed for integration with miniaturized camera modules.
- Power supply voltage: The operating voltage is 5V, ensuring stable performance under appropriate voltage conditions and guaranteeing sensor reliability.

- Temperature range: The operating temperature spans from-20°C to 50°C, offering a wide temperature range that accommodates various working environments.

2.Technical Features:

- Curtain shutter technology: Featuring a line-by-line exposure curtain shutter design, it delivers low imaging noise and fine detail reproduction, with high circuit integration, optimized power consumption and cost efficiency, making it ideal for high-definition imaging in static or low-speed scenarios.
- Utilizing Sony's proprietary second-generation Exmor R back-illuminated CMOS technology, it eliminates the drawback of traditional front-illuminated sensors where circuitry obstructs the light-sensitive surface, significantly enhancing visible and near-infrared light absorption. Paired with STARVIS starlight night vision technology, it delivers clear, noise-free images even in extremely low-light conditions (0.1 lux). When combined with an infrared fill light, it enables all-weather surveillance in complete darkness, delivering exceptional imaging performance in low-light environments. The ultra-low dark current design prevents optical smear issues, ensuring pristine images when capturing moving subjects and maintaining exceptional image clarity during high-speed motion.
- Integrates core algorithms for bad pixel correction, lens shadow correction, and automatic white balance, delivering high-quality raw images without requiring external complex image processing chips. This simplifies backend circuit design and reduces overall development costs and timeframes.
- IMX415 Camera Module: Compatible with various lens configuration standards including 96mm, meeting diverse customer requirements.

3. Application Areas:

Used in biometrics, drones, smart homes, IoT devices, machine vision, barcode scanning, factory automation, and other fields.

4. Personalized Customization Services:

The modular design enables tailored production based on client specifications, delivering products precisely aligned with their needs.

Chongqing Zhongshun Microelectronics Co., Ltd., founded in 2018 and located in Dazu District, Chongqing, is a key science and innovation-based manufacturing enterprise cultivated by the local government. Focusing on semiconductor packaging and testing, MEMS micro-electromechanical devices, as well as optoelectronic and environmental sensors, the company integrates research and development, design, large-scale production and sales, with its core business serving three major tracks: automotive electronics, intelligent equipment and industrial Internet of Things.

1. The company specializes in customized packaging services for mainstream plastic packaging products including BGA, LGA, DFN and QFN, as well as PLCC and MEMS micro-electromechanical devices. It has built a core technical team with extensive practical industrial experience and established a nationwide market service network through branches across multiple regions. As a highly promising backbone player within Chongqing’s semiconductor industrial cluster, it focuses on customized solutions featuring high reliability, small-batch and multi-batch production, which precisely meet stringent technical requirements for vehicle-mounted and industrial scenarios, forming core competitive advantages that distinguish it from large industrial manufacturers.

2. The company delves deep into advanced packaging and sensor integration processes. Its self-developed micro-module connection technology and high-precision sensor packaging technology have been successfully applied in industrial inspection, vehicle-mounted environment perception and other scenarios, providing low-cost, high-reliability pilot test and mass production packaging channels for small and medium-sized chip design enterprises. Meanwhile, leveraging the R&D mechanism for high-tech enterprises, the company continuously shares technical practices such as process optimization and yield improvement with the industry, serving as a technical demonstration platform for the segmented semiconductor sector in Southwest China.

3. The company has successively been awarded titles including National High-tech Enterprise, National Science and Technology-based Small and Medium-sized Enterprise, and Provincial Specialized, Refined, Unique and Innovative Small and Medium-sized Enterprise. It maintains important cooperative ties with the Chinese Academy of Sciences and holds dozens of patents, trademarks and administrative licenses in total. Supported by solid technical reserves and compliant operation capabilities, it ranks among top-quality local enterprises in Chongqing’s microelectronics and sensor industries. Committed to basing its operations in Chongqing, expanding nationwide and connecting with global markets, the company aims to become a benchmark specialized, refined, unique and innovative enterprise in automotive electronic packaging & testing and MEMS sensor sectors across Southwest China. It strives to build an integrated industrial ecosystem featuring "independent R&D, intelligent manufacturing and full-range services", break certain import technical barriers in advanced packaging and industrial sensing fields, and grow into a hidden champion with core pricing power and technological leadership within its segmented tracks.