Automatic Dip Coater Programmable Substrate Dip Withdrawal Coating
Machine Sol-gel Process Multi-layer Dip Wafer Coating System
Product Application
The dip-coating machine is primarily used to prepare thin-film
materials via liquid-phase methods, such as the sol-gel process. A
clean, dry substrate is immersed in a solution (sol) and then
vertically withdrawn at a preset speed. This process deposits a
layer known as a "wet gel film" onto the substrate; as the solvent
evaporates from this layer, it solidifies into a "dry gel film."
Subsequent drying and high-temperature heat treatment transform the
dry gel film into the desired nanomaterial thin film. Film
thickness is determined by the withdrawal speed, liquid
concentration, and liquid viscosity.
Product Overview
This dip-coating machine is specifically designed for research into
thin-film preparation via liquid-phase methods (particularly the
sol-gel process), enabling film growth on various substrates
through dip-coating. Parameters such as withdrawal speed,
withdrawal height, immersion time, number of coating cycles (for
multi-layer deposition), and intervals between coatings are
continuously adjustable and precisely controlled. There are no
special requirements for the substrate; coating can be applied to
sheet, block, or cylindrical shapes. The system operates stably
with no vibration at the liquid surface, significantly enhancing
experimental precision and efficiency.
It is suitable for coating the surfaces of various solid materials,
including silicon wafers, crystal wafers, glass, ceramics, and
metals, and is applicable to both scientific research and
industrial production.
