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| Categories | Memory Connectors |
|---|---|
| Model Number: | 1473149-4 |
| Stock: | 480 |
| Description: | Inline Module Sockets RoHS |
| MOQ: | 20 |
| Packaging Details: | - |
| Brand Name: | TE Connectivity |
| Delivery Time: | 3-5 working days |
| Company Info. |
| Shenzhen ECER Network Technology Co., Ltd. |
| Verified Supplier |
| View Contact Details |
| Product List |
This DDR2 SO DIMM socket is designed for right-angle module orientation with a stack height of .205 inches (5.2 mm). It features 200 positions and is suitable for various circuit applications, adhering to industry standards.
TE
SO DIMM Socket
Double Data Rate (DDR) 2
5.2 mm [.205 in]
Right Angle
200
UL 94V-0
20
Semi-Hard Tray Assembly, Tray
Both Ends
Stainless Steel
Tin
SGRAM Locking
Standard
Standard Keying
Memory Card
Gold Flash
Copper Alloy
5A
Gold Flash
Cam-In
Surface Mount
Solder Peg
Board Mount
High Temperature Thermoplastic
Black
0.6 mm [.024 in]
6.2 mm [.244 in]
-55 - 85 C [-67 - 185 F]
1.8V
2
1
2
Compliant
2011/65/EU Compliant
2000/53/EC Compliant
MIIT Order No 32, 2016 No Restricted Materials Above Threshold
EC No. 1907/2006 Current ECHA Candidate List: JAN 2024 (240), Candidate List Declared Against: JUNE 2023 (235), Does not contain REACH SVHC
Low Halogen - Br, Cl, F, | < 900 ppm per homogenous material. Also BFR/CFR/PVC Free
Reflow solder capable to 260C
| Part Number | 1473149-4 |
|---|---|
| DRAM Type | Double Data Rate (DDR) 2 |
| Stack Height | 5.2 mm [.205 in] |
| Module Orientation | Right Angle |
| Number of Positions | 200 |
| Centerline (Pitch) | 0.6 mm [.024 in] |
| Connector System | Cable-to-Board |
| Terminates To Printed Circuit Board | Printed Circuit Board |
| Number of Bays | 2 |
| Number of Keys | 1 |
| Number of Rows | 2 |
| Housing Material | High Temperature Thermoplastic |
| Housing Color | Black |
| Operating Temperature Range | -55 - 85 C [-67 - 185 F] |
| DRAM Voltage | 1.8V |
| UL Flammability Rating | UL 94V-0 |
| Packaging Quantity | 20 |
| Packaging Method | Semi-Hard Tray Assembly, Tray |
| Ejector Location | Both Ends |
| Latch Material | Stainless Steel |
| Latch Plating Material | Tin |
| Module Key Type | SGRAM Locking |
| Ejector Type | Standard |
| Connector Profile | Standard Keying |
| Memory Socket Type | Memory Card |
| PCB Contact Termination Area Plating Material | Gold Flash |
| Contact Base Material | Copper Alloy |
| Contact Current Rating (Max) | 5A |
| Contact Mating Area Plating Material | Gold Flash |
| Insertion Style | Cam-In |
| Termination Method to Printed Circuit Board | Surface Mount |
| PCB Mount Retention Type | Solder Peg |
| Connector Mounting Type | Board Mount |
| Row-to-Row Spacing | 6.2 mm [.244 in] |
| Product Compliance | Compliant |
| EU RoHS Directive | 2011/65/EU Compliant |
| EU ELV Directive | 2000/53/EC Compliant |
| China RoHS 2 Directive | MIIT Order No 32, 2016 No Restricted Materials Above Threshold |
| EU REACH Regulation | EC No. 1907/2006 Current ECHA Candidate List: JAN 2024 (240), Candidate List Declared Against: JUNE 2023 (235), Does not contain REACH SVHC |
| Halogen Content | Low Halogen - Br, Cl, F, | < 900 ppm per homogenous material. Also BFR/CFR/PVC Free |
| Solder Process Capability | Reflow solder capable to 260C |
|
