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| Shenzhen Huayihai Technology Co., Ltd. |
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Huayihai fabricates custom HDI (High Density Interconnect) PCBs for compact, high-density electronic designs. Boards are built according to customer Gerber files, with laser microvias down to 3 mil and sequential lamination stack-ups up to 2+n+2.
HDI technology allows finer lines, smaller vias, and higher component density than conventional multilayer construction — the foundation for miniaturized products such as communication modules, portable devices, and advanced automotive modules. All HDI boards are manufactured under IPC-A-600 workmanship standards.
Custom Manufacturing Only
We fabricate HDI PCBs according to customer Gerber files and technical specifications. We do not supply ready-made or standard stock boards.
Item | Specification |
HDI Stack-Up | HDI Stack-Up | Up to 2+N+2 | |
Laser Via Diameter | 3 mil minimum |
Layer Count | Per customer requirement (HDI build-up on standard cores) |
Board Thickness | 0.2 – 17.5 mm |
Trace Width / Spacing | 3/3 mil (prototype and volume production) |
Impedance Tolerance | ±5% |
Via Structures | Blind via, buried via, via-in-pad with plugging |
Base Material | FR-4, Hi-Tg, RCC, Rogers, hybrid (per customer requirement) |
Surface Finish | ENIG, Im Sn, Im Ag, OSP, ENIG + OSP (per customer requirement) |
Manufacturing | Custom production per customer requirements |
HDI fabrication at Huayihai combines laser drilling, sequential lamination, and fine-line imaging under one quality process, so dense interconnect designs move from prototype to volume without requalification.
Key fabrication elements include:
HDI PCBs serve products where component density and board space are critical:
Q1: What HDI stack-ups does Huayihai support?
Build-ups up to 2+n+2, including 1+n+1 constructions.
Q2: What is the minimum laser via size?
3 mil laser microvias.
Q3: Can vias be filled?
Yes, via-in-pad with copper paste plugging is available.
Q4: What materials are used for HDI builds?
FR-4, Hi-Tg, RCC, Rogers, and hybrid stack-ups per customer requirement.
Q5: What is the standard lead time?
3–5 working days for PCB prototypes and batches, after file review is complete.
Need custom HDI PCBs with laser microvias and sequential lamination?
Send us your Gerber files and specifications for a quotation. Learn more at nexuspcba.com.
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