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​​Wire Saw Equipment of Vertical/Horizontal/Multi-Wire Cutting​​ for Sapphire/Ceramics/Marble Materials

Categories Semiconductor Equipment
Brand Name: ZMSH
Model Number: Wire Saw Equipment
Certification: rohs
Place of Origin: CHINA
MOQ: 1
Price: by case
Payment Terms: T/T
Delivery Time: 3-6 months
Packaging Details: package in 100-grade cleaning room
Main Motor Power: 11KW – 75KW
Wire Speed: 0 – 40(m/s)
Max. Wire Length​: 20 – 150m
Power Supply​: Standard: Three-phase, 380V, 50Hz
Walking Motor Power​: 0.75KW – 1.5KW
Rotation Angle​: 360°(Electric Control)
Control: Automatic/manual operation. Some models adopt CNC or PLC control systems.
Allowed Working Temperature​​: -15℃ ~ +40℃
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​​Wire Saw Equipment of Vertical/Horizontal/Multi-Wire Cutting​​ for Sapphire/Ceramics/Marble Materials

​​Equipment Overview and Core Value​​


​​Wire Saw Equipment of Vertical/Horizontal/Multi-Wire Cutting​​ for Sapphire/Ceramics/Marble Materials


The wire saw equipment utilizes a high-speed diamond wire as the cutting tool, where diamond abrasives are fixed onto a metal wire via electroplating or resin bonding, forming a flexible cutting system. Its core value lies in achieving ​​high-precision, low-damage cutting​​, significantly improving the processing efficiency and material utilization of hard and brittle materials (e.g., sapphire, ceramics, marble), overcoming the limitations of traditional methods in efficiency and accuracy.




​​Material Processing Characteristics and Applications​​

​​Material Dimension​​​​Sapphire​​​​Ceramics​​​​Marble​​
​​Core Characteristics​​Ultra-high hardness (Mohs 9), high brittlenessHigh hardness, high elastic modulusNon-uniform material, contains hard points like quartz
​​Processing Challenges​​Prone to edge chipping and cracksCutting surface prone to micro-cracksUneven cutting surface and edge chipping
​​Key Metrics​​Surface roughness can reach ​​Ra<0.5μm​​Pursuit of cutting surface integrity, reducing micro-cracksHigh cutting efficiency, good slab flatness
​​Application Directions​​

LED substrates, optical windows, semiconductor substrates


Electronic ceramic substrates, packaging materials, structural ceramics


Architectural decorative slabs, countertops, carving crafts




​​Working Principle Highlights​​

The equipment grinds materials through a continuously circulating diamond wire at high speed, with technical focus varying by material:

  1. ​​Sapphire​​: Requires precise control of parameters like wire speed and tension to avoid brittle fracture (e.g., 20 m/s wire speed and 50 N tension can achieve a surface roughness of Ra<0.5μm).
  2. ​​Ceramics​​: Relies on the grinding action of the diamond wire to reduce stress concentration and minimize micro-crack generation.
  3. ​​Marble​​: Adapts cutting parameters intelligently to accommodate stone heterogeneity, ensuring flat cuts.



​​Processing Methods and Effects​​

​​Material​​​​Block Cutting​​​​Cross Cutting​​​​Multi-Wire Cutting​​Effects​​
​​Sapphire​​Narrow kerf (0.55mm), surface roughness <1μm, reduces material lossFast cutting speed, suitable for ingot truncation and shapingSimultaneous multi-slice cutting enhances efficiency for materials like silicon wafers
​​Ceramics​​Neat cutting surface, minimal edge damage, ideal for standard substrate preparationSuitable for precision machining of special-shaped components, high flexibilityHigh-volume production of uniform components with high efficiency
​​Marble​​High cutting efficiency, flat slab surface beneficial for subsequent polishingUsed for block shaping and large slab divisionSingle cut generates multiple large slabs, suitable for large-scale projects

​​Core Parameters​​

​​Parameter​​​​Range/Specification​​
Main Motor Power11–75 kW (common models: 22kW, 37kW, 55kW)
Wire Speed0–40 m/s (high-speed models up to 45 m/s)
Maximum Wire Length20–150 m (increases with power)
Power SupplyThree-phase 380V/50Hz (customizable)
Control MethodAutomatic/manual, supports CNC or PLC systems
Operating Temperature-15°C ~ +40°C



​​Service Commitment​​


ZMSH provides ​​integrated manufacturing and trading solutions​​, covering equipment selection, process optimization, and after-sales support:

  • ​​Customized Design​​: Configures parameters based on material properties (e.g., hardness, size).
  • ​​Technical Training​​: Offers operation and maintenance training to ensure efficient equipment performance.
  • ​​Full-Cycle Service​​: Provides end-to-end technical support and rapid response from trial cuts to mass production.



FAQ of Wire Saw Equipment


​​Q1: How does a wire saw equipment achieve precise cutting?​​

A1: The equipment uses a high-speed diamond-coated wire that acts as a flexible grinding tool, abrasively cutting through materials while maintaining minimal kerf loss and high accuracy due to controlled tension and linear motion.


​​Q2: What makes wire saws suitable for environmentally sensitive operations?​​

A2: Wire saws eliminate the need for cooling fluids in many cases, reduce waste generation by up to 80% compared to traditional methods, and operate with lower noise and energy consumption, aligning with green manufacturing standards.


​​Q3: How do wire saws handle complex shapes or large-scale projects?​​

A3: With multi-wire configurations, they can simultaneously cut multiple slices from a single block, enabling efficient processing of intricate geometries or massive slabs—ideal for architectural stonework or semiconductor wafer production.



Tags: #Wire Saw Equipment, #Customized, #Vertical/Horizontal/Multi-Wire Cutting, #Sapphire/Ceramics/Marble Materials

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