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TIF500-50-11ES Electrically Isolating Multiple Thickness Factory Thermal Pad Pad For Electric Products

Categories Thermal Pad
Brand Name: Ziitek
Model Number: TIF500-50-11ES
Certification: RoHS
Place of Origin: Vietnam
MOQ: 1000pcs
Price: 0.1-10 USD/PCS
Payment Terms: T/T
Supply Ability: 100000pcs/day
Delivery Time: 3-5 work days
Packaging Details: 24*13*12cm cartons
Products name: Electrically Isolating Multiple Thickness Factory Thermal Pad Pad For Electric Products
Keywords: Thermal Pad
Application: GPU CPU Chip Display Card
Specific Gravity: 3.3g/cc
Materials: Ceramic filled silicone elastomer
Sample: Sample free
Flame rating: 94-V0
Hardness: 10 Shore 00
Thermal conductivity: 5.0W/mK
Color: Gray
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TIF500-50-11ES Electrically Isolating Multiple Thickness Factory Thermal Pad Pad For Electric Products

TIF500-50-11ES Electrically Isolating Multiple Thickness Factory Thermal Pad Pad For Electric Products


Product descriptions


TlF®500-50-11ES is a thermal pad specifically designed to address the most demanding thermal challenges and highly sensitive mechanical stress environments. Combining exceptional thermal conductivity with near-fluid softness, it ensures perfect filing of contact interfaces even under ultra-low installation pressure, completely eliminating air thermal resistance. This delivers an outstanding thermal management solution and physical protection for the most precise and high-heat-flux-density electronic components.


Features


> Good thermal conductive 5.0W/mK
> Moldability for complex parts
> Soft and compressible for low stress applications
> Naturally tacky needing no further adhesive coating
> Available in varies thicknesses
> Broad range of hardnesses available


Application


> Monitoring the Power Box
> AD-DC Power Adapters
> Rainproof LED Power
> Waterproof LED Power
> SMD LED module
> LED Flesible strip, LED bar
> LED Panel Light
> LED floor light
> Routers
> Medical Devices
> Auditioning electronic products
> unmanned aerial vehicle(UAV)
> Photovoltaic
> Signal communication
> New energy vehicle
> Motherboard chip
> Radiator


Typical Properties of TIF®500-50-11ES Series
PropertyValueTest method
ColorGrayVisual
Construction &CompostionCeramic filled silicone elastomer******
Thickness range(inch/mm)

0.02"~0.03"/

(0.50mm)~(0.75mm)

0.04"~0.20"/

(1.0mm)~(5.0mm)

ASTM D374
Density3.3g/cm³ASTM D792
Hardness10 Shore 00ASTM 2240
Continuos Use Temp-45 to 200℃******
Dielectric Breakdown Voltage> 5500 VACASTM D149
Dielectric Constant3.8 MHzASTM D150
Volume Resistivity>1.0 X1012 Ohm-meterASTM D257
Flame rating94 V0UL E331100
Thermal conductivity5.0 W/m-KASTM D5470

Product Specification


Standard Thickness: 0.02"(0.50 mm)~0.20” (5.00 mm) with increments of 0.01 inch (0.25 mm).
Standard Size: 16" ×16" (406 mm×406 mm).


Component Codes:


Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).
The TIFseriesis available in custom shapes and various forms.For other thicknessesormore
information, please contact us.

Packaging Details & Lead time


The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized


Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated


Company Profile


Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!


Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL


Independent R&D team


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