Sign In | Join Free | My benadorassociates.com
benadorassociates.com
Products
Search by Category
Home >

15mil Rogers TMM6 PCB 2-Layer with 0.5mm Thickness and 40mm × 70mm Dimensions

Categories Rogers PCB Board
Brand Name: Bicheng
Model Number: BIC-052.V1.0
Certification: UL, ISO9001, IATF16949
Place of Origin: CHINA
MOQ: 1PCS
Price: USD9.99-99.99
Payment Terms: T/T
Supply Ability: 5000PCS per month
Delivery Time: 8-9 working days
Packaging Details: Vacuum bags+Cartons
Base material: TMM6
Layer count: 2-layer
PCB thickness: 0.5mm
PCB size: 40mm × 70mm per unit (1PCS), with a tolerance of ±0.15mm
Copper weight: 1oz (equivalent to 1.4 mils or 35μm)
Surface finish: Immersion silver
  • Haven't found right suppliers
  • Our buyer assistants can help you find the most suitable, 100% reliable suppliers from China.
  • And this service is free of charge.
  • we have buyer assistants who speak English, French, Spanish......and we are ready to help you anytime!
Submit Buying Request
  • Product Details
  • Company Profile

15mil Rogers TMM6 PCB 2-Layer with 0.5mm Thickness and 40mm × 70mm Dimensions

This high-performance 2-layer rigid printed circuit board (PCB) is meticulously engineered using Rogers' TMM6 thermoset microwave material—a ceramic-thermoset polymer composite optimized for stripline and microstrip applications—to meet stringent electrical, thermal, and mechanical standards, making it ideal for a wide range of high-frequency RF, microwave, and communication systems.


PCB Specification

ItemSpecification
Base MaterialTMM6 (Rogers thermoset microwave ceramic-polymer composite)
Layer Count2 layers
Board Dimensions40mm × 70mm per unit (1PCS), with a tolerance of ±0.15mm
Minimum Trace/Space4 mils (trace width) / 5 mils (trace spacing)
Minimum Hole Size0.2mm
Blind ViasNo
Finished Board Thickness0.5mm
Finished Cu Weight (Outer Layers)1oz (equivalent to 1.4 mils or 35μm)
Via Plating Thickness20 μm
Surface FinishImmersion silver
SilkscreenNo
Solder MaskNo
Electrical Test (Prior to Shipment)100% electrical test (covers continuity, insulation resistance, and short-circuit detection)

Layer Stack-up

The 2-layer stack-up is precisely designed to maximize the performance advantages of Rogers TMM6 material, with clear layer functions and thicknesses:

Layer TypeMaterialThickness
Top Conductive LayerCopper_layer_135μm
Core Insulation LayerRogers TMM6 Thermoset0.381mm (15mil)
Bottom Conductive LayerCopper_layer_235μm

Artwork Format: Gerber RS-274-X, the industry-standard PCB fabrication format, ensuring compatibility and reducing fabrication errors.


Quality Standard: Complies with IPC-Class 2, meeting the reliability requirements of commercial and industrial high-frequency applications—ensures consistent performance under normal operating conditions and environmental variations.


Availability: Worldwide shipping.


Material Attributes of Rogers TMM6

As a ceramic-thermoset polymer composite tailored for microwave applications, Rogers TMM6 possesses unique properties that form the foundation of the PCB’s high performance:



1. Electrical Performance

Dielectric Constant (Dk): 6.0 ± 0.08 at 10GHz, with tight tolerance to ensure predictable signal propagation—critical for designing precise RF/microwave components such as filters and couplers.

Dissipation Factor (Df): 0.0023 at 10GHz, ultra-low loss to minimize signal attenuation—maintains signal integrity even in long trace routes, which is essential for high-frequency communication systems.


Thermal Coefficient of Dk: -11 ppm/°K, minimizing Dk drift caused by temperature changes—ensures stable performance in environments with fluctuating temperatures (such as outdoor communication equipment or satellite systems).


2. Thermal & Mechanical Resilience

Decomposition Temperature (Td): 425°C (TGA), withstanding high temperatures generated by power dissipation (e.g., in power amplifiers) and reflow soldering processes—prevents material degradation under extreme heat.


Coefficient of Thermal Expansion (CTE): 18 ppm/K (x-axis), 18 ppm/K (y-axis), 26 ppm/K (z-axis), matching the CTE of copper—avoids delamination between copper layers and TMM6 core during thermal cycling, enhancing structural stability.


Thermal Conductivity: 0.72 W/mK, efficiently dissipating heat from high-power components—reduces thermal hotspots and extends the service life of sensitive RF devices.


Mechanical Strength: Resists creep and cold flow, maintaining dimensional stability under mechanical stress—suitable for rugged applications such as automotive GPS antennas or aerospace communication modules.


3. Fabrication & Application Advantages

Process Compatibility: Compatible with all common PCB manufacturing processes (including etching, drilling, and plating), eliminating the need for specialized production techniques—reducing manufacturing costs and lowering technical barriers.


Chemical Resistance: Resistant to process chemicals (such as etchants and cleaning agents), minimizing material damage during fabrication and reducing reject rates.


Wire-Bonding Reliability: Based on thermoset resin, enabling stable wire bonding for RF chips—ensures reliable high-frequency signal transfer between chips and the PCB, which is critical for microwave circuit performance.


Some Typical Applications:

- RF and microwave circuitry

- Power amplifiers and combiners

- Filters and coupler

- Satellite communication systems

- Global Positioning Systems Antennas

- Patch Antennas

- Dielectric polarizers and lenses

- Chip testers


Buy 15mil Rogers TMM6 PCB 2-Layer with 0.5mm Thickness and 40mm × 70mm Dimensions at wholesale prices
Send your message to this supplier
 
*From:
*To: Bicheng Electronics Technology Co., Ltd
*Subject:
*Message:
Characters Remaining: (0/3000)
 
Inquiry Cart 0