Overview

The silicon carbide wafer boat (SiC Susceptor/Boat) is a high-performance carrier widely used in semiconductor, photovoltaic, and compound semiconductor manufacturing. It is designed to hold and support wafers during high-temperature processes such as diffusion, oxidation, and LPCVD.
Compared to traditional quartz boats, SiC wafer boats offer superior thermal stability, chemical resistance, mechanical strength, and longer service life, making them the ideal choice for next-generation wafer processing.

Key Features

• High thermal stability: Can withstand >1600 ℃ without deformation or cracking.

• Excellent chemical resistance: Resistant to corrosive atmospheres such as HCl, Cl₂, NH₃, minimizing contamination.

• Superior mechanical strength: Low thermal expansion and outstanding thermal shock resistance.

• Low particle generation: High density with mirror-polished surface significantly reduces particle contamination.

• Extended service life: 2–5 times longer than quartz boats, lowering overall cost of ownership.

• Customizable design: Available in different structures (flat, V-shaped, multi-tiered) according to equipment and process requirements.

Manufacturing Process

1. Raw Material Preparation

   • High-purity SiC powder (>99.9%) or carbon-based substrates are selected.

   • Material purity and particle size distribution are critical to final density and strength.

2. Forming

   • Cold Isostatic Pressing (CIP), molding, or 3D printing methods are used to shape the green body.

   • Ensures uniform structure without cracks.

3. High-Temperature Sintering

   • Performed in vacuum or inert atmosphere above 2000 ℃.

   • Produces dense, high-strength SiC bulk material.

4. CVD/CVI Coating

   • Chemical Vapor Deposition or Infiltration enhances surface density and purity.

   • Provides a smooth, stable surface with minimized particle shedding.

5. Precision Machining

   • CNC machining and ultrasonic grinding achieve complex structures with high dimensional accuracy (±0.01 mm).

6. Surface Treatment & Polishing

   • Chemical Mechanical Polishing (CMP) achieves Ra < 5 nm.

   • Meets stringent semiconductor cleanliness requirements.

7. Inspection & Packaging

   • Density, thermal shock, and particle tests are conducted.

   • Products are then clean-packed for delivery.

Application Fields

• Semiconductor manufacturing: Diffusion, LPCVD, oxidation furnace wafer carriers.

• Photovoltaic industry: Solar cell diffusion and annealing processes.

• Compound semiconductors: SiC and GaN epitaxy and high-temperature treatments.

• Research & development: High-temperature experiments in universities and labs.

Typical Specifications (Customizable)

• Wafer size: 6" / 8" / 12"

• Material purity: >99.9% SiC

• Operating temperature: ≤1650 ℃

• Surface roughness: Ra < 5 nm (mirror-polished)

• Service life: 2–5× longer than quartz boats

SiC Wafer Boat – FAQ

1. What are the advantages of SiC wafer boats compared to quartz boats?

Answer: SiC boats offer superior thermal stability (>1600 ℃), excellent chemical resistance, outstanding thermal shock resistance, and higher mechanical strength. With mirror-polished surfaces, they generate fewer particles and last 2–5 times longer than quartz boats.

2. What is the typical service life of SiC wafer boats?

Answer: Depending on process conditions, the service life is typically 2–5 times that of quartz boats, significantly reducing replacement frequency and total cost of ownership.

3. Are customized sizes and structures available?

Answer: Yes. We provide customized designs for different wafer sizes (6", 8", 12") and structures (flat boats, V-shaped boats, multi-tier designs) according to customer equipment and process requirements.

4. How is surface roughness and cleanliness controlled?

Answer: Through precision machining and CMP (Chemical Mechanical Polishing), the surface roughness can reach Ra < 5 nm, ensuring ultra-low particle release and meeting the strictest semiconductor cleanliness standards.