Red Oil Double Sided PCB Board OSP Surface Treatment 0.4mm Thickness Versatile

• Red oil solder mask + OSP treatment + double-sided structure: The red ink ensures stable insulation, striking visual distinction for circuit areas, and a distinct appearance; the ultra-thin (0.1-0.3μm) OSP film guarantees oxidation resistance and reliable solderability; the double-sided design supports bidirectional signal transmission.​

• Layered functionality: Red solder mask isolates non-welding areas, while OSP-treated pads enable secure component bonding, with both working in tandem to maintain circuit integrity.​

• Process compatibility: The combination of red ink solder mask and OSP treatment is stable, with good material compatibility, fitting seamlessly into standard production workflows.

• High-visibility identification: The bright red solder mask simplifies circuit inspection, fault diagnosis, and assembly verification, reducing human error in production and maintenance processes.​

• Reliable solderability: The OSP film is easily removed during soldering, ensuring excellent solder wetting on copper surfaces, minimizing cold solder joints, and adapting to fine-pitch components like QFP.​

• Effective protection: The red ink solder mask isolates the circuit from moisture, dust, and physical abrasion, while the OSP film prevents copper oxidation, extending the board’s storage and service life.​

• Cost-effectiveness: The low-cost OSP process combined with economical red ink and standard double-sided substrate results in controllable production costs, suitable for cost-sensitive applications in consumer electronics and home appliances.​

• Environmental friendliness: The OSP process uses non-toxic organic compounds, and red ink is typically eco-friendly, complying with environmental regulations and reducing hazardous waste.​

• Dimensional precision: The thin OSP layer and red ink do not significantly alter the board’s thickness or flatness, maintaining precision for high-density double-sided circuit designs.​