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| Categories | High Frequency PCB |
|---|---|
| Brand Name: | xingqiang |
| Model Number: | Varies by goods condition |
| Certification: | ROHS, CE |
| Place of Origin: | China |
| MOQ: | Sample,1 pc(5 square meters) |
| Price: | NA |
| Payment Terms: | ,T/T,Western Union |
| Supply Ability: | 3000㎡ |
| Delivery Time: | 15-20 work days |
| Materials: | FR-4 |
| Surface Finished: | Immersion Gold |
| Copper Thicknes: | 1/1/1/1/1/1oz |
| Impedance Control: | Yes |
| Layer Count: | 1-30 layers |
| Silk Screen: | white |
| Blind/Buried Vias: | Available |
| Usage: | Communication PCB |
| Min. Line Width/Spacing: | 3mil |
| Quotation requirements: | Gerber files,BOM |
| Company Info. |
| Dongguan Xingqiang Circuit Board Technology Co., Ltd. |
| Verified Supplier |
| View Contact Details |
| Product List |
6-layer blue oil electric gold high-frequency industrial control version
The 6-Layer Blue Solder Mask Immersion Gold Industrial Control PCB is a high-performance printed circuit board specifically engineered for industrial control applications. As a critical component in industrial automation systems, it integrates seamlessly into industrial machinery, automation equipment, and control modules, serving as the core platform for electrical signal transmission, control command execution, and stable power distribution. This industrial control PCB features a specialized 6-layer architecture, complemented by blue solder mask coating and immersion gold finishing—key enhancements that deliver multiple performance advantages. The immersion gold surface treatment ensures superior electrical conductivity, excellent oxidation resistance, and reliable solderability, while the blue solder mask provides robust insulation protection and enhances environmental resilience against moisture, dust, and chemical exposure. Designed to meet stringent industrial standards, the PCB incorporates advanced engineering considerations including optimized power management, signal integrity preservation, and electromagnetic interference (EMI) mitigation.
Product Features:
Core Manufacturing Challenges
1. High difficulty in fine line and space processing: Line width/space is often less than 0.1mm, requiring
high-precision etching processes, which are prone to uneven line
width, short circuits, or open circuits.
2. Complex multi-layer interconnection process: With more layers (usually 8 or more) and the need for microvia,
blind via, and buried via technologies, the requirement for
drilling alignment is extremely high, making hole position
deviation or poor metallization likely.
3. Difficult impedance control: The high-density wiring and multi-layer structure result in
complex signal transmission paths, requiring precise impedance
matching to avoid signal reflection and interference.
4. Strict material selection and compatibility requirements: Special substrates with low loss and high temperature resistance
must be used, and the thermal expansion coefficients of different
materials need to match to prevent interlayer separation.
5. Difficult quality inspection and defect control: Tiny line defects, hole wall defects, etc., are hard to detect
through conventional testing, imposing high requirements on testing
equipment and process control.
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