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| Categories | High Frequency PCB |
|---|---|
| Brand Name: | xingqiang |
| Model Number: | As Per Customer's Model |
| Certification: | ISO 9001 / RoHS /UL / IATF 16949 (automotive) |
| Place of Origin: | China |
| MOQ: | Sample,1 pc(5 square meters) |
| Price: | Based on Gerber Files |
| Payment Terms: | ,T/T,Western Union |
| Supply Ability: | 100000㎡/Month |
| Delivery Time: | NA |
| Product Name: | High Frequency PCB |
| Blind/Buried Vias: | Yes |
| Min. Line Width/Spacing: | 3mil |
| Layer Count: | 1-30 layers |
| Surface Finished: | Immersion Gold |
| Materials: | Rogers/Isola/PTFE |
| Usage: | Smart Devices |
| Impedance Control: | +/-10% or +/-5% |
| Quotation requirements: | Gerber files,BOM |
| Silk Screen: | White,Black,Blue,Red,Yellow,Green |
| Company Info. |
| Dongguan Xingqiang Circuit Board Technology Co., Ltd. |
| Verified Supplier |
| View Contact Details |
| Product List |
XingQiang Custom PCB for Smartphone Core Modules:
This custom PCB features blue solder mask and immersion gold finish, tailored for smartphone core modules and mobile devices. It ensures stable high-speed signal transmission and efficient power distribution, with excellent conductivity, oxidation resistance and reliable solderability. Custom-engineered to strict electronic standards, it optimizes signal integrity, EMI mitigation and compact layout for mobile device applications.
Product Features:
Multilayer Architecture: Precision multi-layer design for high-density wiring, minimal crosstalk, optimized space utilization and complex circuit integration.
Blue Solder Mask: Robust insulation & mechanical protection, resistant to moisture, dust and chemicals in harsh industrial environments.
Immersion Gold Finishing: Superior conductivity, oxidation resistance and solderability for long-term connection stability and low maintenance.
Industrial-Grade Reliability: High-performance glass fiber epoxy substrate, stable operation in extreme temps (-40°C~125°C), high humidity and chemical exposure.
Enhanced Signal Integrity: Optimized layout for power management and signal integrity, built-in EMI mitigation for accurate control signal & data transmission.
Core Manufacturing Challenges
1. High difficulty in fine line and space processing: Line width/space is often less than 0.1mm, requiring
high-precision etching processes, which are prone to uneven line
width, short circuits, or open circuits.
2. Complex multi-layer interconnection process: With more layers (usually 8 or more) and the need for microvia,
blind via, and buried via technologies, the requirement for
drilling alignment is extremely high, making hole position
deviation or poor metallization likely.
3. Difficult impedance control: The high-density wiring and multi-layer structure result in
complex signal transmission paths, requiring precise impedance
matching to avoid signal reflection and interference.
4. Strict material selection and compatibility requirements: Special substrates with low loss and high temperature resistance
must be used, and the thermal expansion coefficients of different
materials need to match to prevent interlayer separation.
5. Difficult quality inspection and defect control: Tiny line defects, hole wall defects, etc., are hard to detect
through conventional testing, imposing high requirements on testing
equipment and process control.

Factory showcase

PCB Quality Testing

Certificates and Honors


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