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| Categories | Automotive PCB |
|---|---|
| Brand Name: | xingqiang |
| Model Number: | As Per Customer's Model |
| Certification: | ISO 9001 / RoHS /UL / IATF 16949 (automotive) |
| Place of Origin: | China |
| MOQ: | Sample,1 pc(5 square meters) |
| Price: | Based on Gerber Files |
| Payment Terms: | ,T/T,Western Union |
| Supply Ability: | 100000㎡/Month |
| Delivery Time: | NA |
| Packaging Details: | Carton Or As Your Request |
| Product: | Custom Automotive PCB |
| Material: | FR4 |
| Min.line Width: | 3mil |
| The Min.hole: | 0.1mm |
| Board Thickness: | 0.2-5.0mm |
| PTH: | +/-0.075mm |
| Minimum Line Space: | 3mil (0.076mm) |
| Surface Finishing: | HASL/OSP/ENIG |
| Quotation: | Gerber Files or BOM List |
| Regular Layer: | 2-Layers,4-Layers,6-Layers,8-Layers or 8L+ |
| Company Info. |
| Dongguan Xingqiang Circuit Board Technology Co., Ltd. |
| Verified Supplier |
| View Contact Details |
| Product List |
Xingqiang Custom High‑Precision Automotive HDI PCB:
This is Xingqiang Circuit Board’s custom 6‑layer HDI automotive PCB, a high‑precision multilayer circuit board designed for automotive electronics, communication, and industrial control. Built with high‑TG FR‑4 material, it features excellent high‑temperature resistance, fine line capability, and professional surface finishing (ENIG/HASL/OSP). It delivers stable signal transmission, strong anti‑interference, and long‑term reliability under harsh conditions. Supporting full customization from prototype to mass production, it complies with strict automotive quality standards and is ideal for ECU, BMS, ADAS, and other critical vehicle electronic applications.
Automotive PCB Key Features
| Feature | Brief Description |
| High-Temp Resistance | Withstands -40°C to 125°C for engine bay & harsh automotive environments. |
| Vibration Durability | Reinforced substrate structure resists mechanical stress from vehicle operation. |
| EMI Shielding | Minimizes electromagnetic interference to ensure stable signal transmission. |
| High Integration | Dense trace layout supports compact ADAS, infotainment & EV power systems. |
| Custom Design Flexibility | Available as rigid/flex/rigid-flex/HDI to fit curved vehicle components & high-power modules. |
| Automotive-Grade Compliance | Meets IATF 16949 standards for safety & reliability in critical vehicle functions. |
Production Requirements of Automotive Electronic PCB Board
Customers are required to provide Gerber Files and a Bill of Materials (BoM) list. These essential documents ensure that the manufacturing process is accurate and efficient, resulting in high-quality boards that meet the desired specifications.
Normally Gerber Files Included:
1.Pcb Type(Single/Double/Multi-layer/HDI)
2.Board Thickness(1.2/1.6/1.0/0.8mm)
3.Oil Ink Color(Green,Red,White,Black,Blue)
4.Surface Treatment Process(OSP,HASL,ENIG,Lead,Lead Free)
5.Solder mask requirements
6.Silkscreen requirements ect,.
Key Manufacturing Technical Challenges of Automotive PCBs
1.Extreme Environment Adaptability:Specialized substrates (high-TG FR-4, MCPCB) require optimized
lamination to maintain structural and electrical stability across
-40°C to 125°C, resist continuous vibration, and endure high
humidity without performance loss.
2. High-Precision Trace Processing:High-resolution photolithography is needed to create ultra-fine
lines/spaces (≤0.1mm) for HDI boards, with strict copper thickness
control to minimize signal loss and crosstalk for ADAS and
autonomous driving systems.
3. EMI/EMC Shielding Integration:Shielding layers (conductive coating, metal cladding) must be
integrated into the board structure during fabrication, ensuring
consistent coverage to suppress electromagnetic interference for
safety-critical circuits.
4. Reliable Interlayer Connection:Blind/buried vias for multi-layer EV power PCBs demand
high-precision drilling and electroplating to ensure uniform copper
coverage on via walls, preventing conductivity failures from
plating voids or insufficient thickness.
5. Automotive-Grade Compliance Control:Full adherence to IATF 16949 standards is mandatory, including 100%
AOI for zero-defect soldering and batch thermal stability testing
to verify long-term reliability for automotive use cases.
6. Flex-Rigid Hybrid Structure Fabrication:Compatible adhesives and optimized lamination parameters are
required to balance bonding strength between rigid and flexible
sections, preventing delamination under repeated bending for curved
vehicle components.

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PCB Quality Testing

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