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| Categories | Polyimide PI Film |
|---|---|
| Brand Name: | Guofeng |
| Model Number: | GC |
| Certification: | UL ISO RoHS |
| Place of Origin: | China Hefei |
| MOQ: | 5kg |
| Price: | $300-$30000 |
| Payment Terms: | L/C,T/T |
| Supply Ability: | Negotiation |
| Delivery Time: | Negotiation |
| Packaging Details: | Barrier+ PE foam sheet+ PE film+ Foam packing cotton |
| Film Appearance: | The base material shall achieve atomic-scale surface uniformity while exhibiting total elimination of morphological irregularities, nanoscale particulate embeddings, cross-linked polymer clusters, or non-native impurities throughout its operational zone, w |
| Film Thickness (um): | 62 |
| Film Tensile Strengthh: | 180MPa |
| Film Elongation at break: | 30% |
| Film Young's Modulus: | 3.5GPa |
| Film Insulation Strength: | 220V/μm |
| Flame Retardant: | V-0 Level |
| Thermal conductivity: | 1500 W/(mK) |
| Company Info. |
| Hefei Guofeng Advanced Basic Materials Technology Co., Ltd. |
| Verified Supplier |
| View Contact Details |
| Product List |
Product Characteristics
Precision-Aligned Molecular Framework
Our film is manufactured using a proprietary biaxial tension
process that induces a highly ordered in-plane molecular
arrangement. This engineered nanostructure remains stable
throughout carbonization and graphitization, enabling exceptional
thermal conduction properties in the resulting artificial graphite
film.
Homogeneous Thermal Transformation
Precisely calibrated thermal protocols ensure uniform reaction
dynamics during high-temperature processing. This controlled
conversion yields a flawlessly consistent foamed architecture free
of imperfections, significantly enhancing product reliability.
Tailored Polymer Matrix
Featuring a optimized molecular weight profile with virtually no
short-chain residues, the end product achieves superior mechanical
resilience. This refined composition provides remarkable fold
endurance and eliminates particulate shedding, ensuring extended
service life in demanding applications.
Product Applications
Ultra-High Thermal Conduction Components
Engineered with our specialized GC-type polyimide carbon matrix,
the derived artificial graphite film achieves unparalleled thermal
diffusion properties. It serves as a core heat dissipation element
in advanced electronics such as ultra-compact smartphones,
high-power computing devices, and 5G infrastructure equipment.
Next-Generation Flexible Electronics Foundation
The same GC-type polyimide film also functions as a high-stability
substrate material for flexible and foldable technologies. Its
exceptional dimensional and thermal stability supports applications
including lightweight conformal solar cells and robust flexible
displays for wearables and foldable devices.


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