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| Categories | Copper Clad Polyimide Film |
|---|---|
| Brand Name: | Guofeng |
| Model Number: | 12.5um |
| Certification: | SGS ROHS |
| Place of Origin: | China Hefei |
| MOQ: | 5kg |
| Price: | $300-$30000 |
| Payment Terms: | L/C,T/T |
| Supply Ability: | Negotiation |
| Delivery Time: | Negotiation |
| Packaging Details: | Barrier+ PE foam sheet+ PE film+ Foam packing cotton |
| Appearance: | The surface is planar and devoid of any wrinkles, air bubbles, adhesive seepage, or foreign contaminants. |
| Thickness: | 12.5μm |
| Tensile Strengthh: | 220MPa |
| Elongation at break: | 40% |
| Young's Modulus: | 3.8GPa |
| Insulation Strength: | 250V/μm |
| Density: | 1425Kg/m³ |
| Thermal Shrinkage(200°,2h): | 0.08% |
| Company Info. |
| Hefei Guofeng Advanced Basic Materials Technology Co., Ltd. |
| Verified Supplier |
| View Contact Details |
| Product List |
High-Performance Material: Delivers exceptional strength, electrical insulation, and heat resistance.
Superior Bonding: Ensures excellent surface adhesion for reliable integration.
Global Compliance & Safety: Meets all RoHS and REACH requirements and carries UL certification.
Unmatched Mechanical Performance: Possesses extremely high tensile strength and durability.
Outstanding Dimensional Stability: Features an extremely low CTE for reliable operation under thermal stress.
Superior Bonding Capability: Ensures excellent adhesion for secure integration.
Global Environmental Compliance: Meets all requirements of RoHS and REACH directives.
Recognized Safety Standard: Certified for safety by Underwriters Laboratories (UL).
The GL high-performance polyimide film finds its primary application in the manufacture of high-precision adhesive FCCL substrates, high-stability coverlays, advanced chip packaging, and specialized adhesive tape substrates.


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