Rigid Polyimide 4-Layer PCB: 1.8mm Thick, HASL Finish, and High-Temperature Performance

Rigid Polyimide 4-Layer PCB: 1.8mm Thick, HASL Finish, and High-Temperature Performance

(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)

Overview of the 4-Layer Rigid Polyimide PCB

The 4-layer rigid Polyimide PCB is a high-performance solution designed for demanding applications in aerospace, , and high-temperature electronics. Built with polyimide material, this PCB exhibits exceptional thermal stability, high-frequency dielectric performance, and mechanical strength.

With a 1.8mm thickness, HASL lead-free surface finish, and black solder mask, this PCB is engineered for reliability and durability in extreme environments. Its resin-filled and capped vias and countersunk holes make it ideal for precision applications requiring high mechanical and electrical performance.

PCB Construction Details

The 4-layer rigid Polyimide PCB is manufactured to strict standards, ensuring durability, stability, and consistent performance. Below are the detailed construction specifications:

PCB Stackup

The 4-layer stackup is engineered to deliver thermal robustness, electrical stability, and high-frequency performance. Below is the detailed layer structure:

PCB Statistics

The 4-layer rigid Polyimide PCB is optimized for complex designs and high-density layouts. Below are its key statistics:

• Components: 68
• Total Pads: 102
• Thru Hole Pads: 47
• Top SMT Pads: 39
• Bottom SMT Pads: 16
• Vias: 121
• Nets: 12

Introduction to Rigid Polyimide Material

Polyimide is a high-performance polymer known for its thermal stability, mechanical strength, and excellent electrical insulation properties. Its unique properties make it ideal for high-temperature, high-frequency, and mechanically demanding environments.

Key attributes include:

• Thermal Stability: Maintains integrity under extreme temperatures, passing 288°C thermal stress tests without delamination or blistering.
• Electrical Insulation: High volume resistivity (6.6×10⁸ MΩ·cm) and surface resistivity (3.4×10⁷ MΩ) ensure reliable performance.
• Moisture Resistance: Low absorption rate (0.11%) prevents performance degradation in humid environments.
• Mechanical Strength: Strong bending strength (410.2 N/mm²) ensures durability in dynamic applications.

Features of Rigid Polyimide Material

• Dielectric Constant (Dk): 4.12 at 1MHz
• Dissipation Factor: 0.0072 at 1MHz
• Thermal Stress: Withstands 288°C without delamination or blistering
• Flammability: UL-94 V0
• Moisture Absorption: 0.11%
• Dielectric Breakdown Voltage: 44.3 kV
• Glass Transition Temperature (Tg): 257°C

Benefits of Rigid Polyimide PCB

1. Exceptional Thermal Resistance: Withstands high temperatures for aerospace and applications.
2. High Dielectric Performance: Maintains stability for high-frequency circuits.
3. Mechanical Durability: Strong peel and bending strength for reliability in demanding environments.
4. Moisture Resistance: Prevents performance degradation in humid conditions.
5. Low Dielectric Loss: Ensures high signal integrity for sensitive applications.

Applications of Rigid Polyimide PCB

The 4-layer rigid Polyimide PCB is engineered for high-performance applications across industries, including:

Aerospace Equipment: Ensures reliability in extreme environments.

Electronics: Ideal for radar, communication, and defense systems.

High-Temperature Applications: Withstands temperatures up to 288°C.

Downhole Oil Extraction Electronics: Performs reliably in harsh conditions.

High-Frequency Circuits: Provides stable dielectric properties for RF applications.

Why Choose the 4-Layer Rigid Polyimide PCB?

The 4-layer rigid Polyimide PCB is the ideal choice for critical high-temperature and high-frequency applications. Its 1.8mm thickness, HASL finish, and resin-filled vias ensure mechanical robustness, electrical stability, and long-term reliability.

Contact us today to learn more about this high-performance PCB or to place an order for your project!

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