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| Categories | Quick Turn PCB Assembly |
|---|---|
| Brand Name: | Suntek |
| Model Number: | F9632-7582 |
| Certification: | ISO9001, ISO13485, TS16949 and UL E476377 |
| Place of Origin: | China |
| MOQ: | 1pcs |
| Price: | USD1 |
| Payment Terms: | T/T,Paypal |
| Supply Ability: | 100pcs/hour |
| Delivery Time: | 1-2 weeks after all parts collected |
| Packaging Details: | Vacuum,Anti-static,ESD,Cartons |
| Base Material: | FR4+PI, PI/Custom |
| Surface Treatment: | ENIG |
| Rohs Compliance: | Yes |
| Qty: | Support Prototype And Batch Production |
| Suface: | ENIG 2U |
| Copper Thickness: | 0.5-6oz |
| Impedance Control: | 50/90/100±10% Ohm |
| Company Info. |
| Suntek Electronics Co., Ltd. |
| Verified Supplier |
| View Contact Details |
| Product List |
Suntek provide:
-PCB/FPC fabrication
-Components sourcing
-PCB/FPC assembly
-Custom cable/harness assembly
-Box build
Services as below:
-SMT, THT, BGA,0201 Chips assembly
-AOI, X-Ray, ICT, FT, Burn-in
-Conformal coating or gluing
-High-mix, small to medium volume
With certification by ISO9001, ISO13485, TS16949 and UL .
SMT Parameters:
| H 高 | ◆SMT+ICT+THT+FT ◆SMT+ICT+THT+Harness+Assembly+FT | ◆SMT machine(for printing,pick place,reflow soldering) ◆THT machine(for wave soldering) ◆Terminal machine... | ◆AOI ◆X-RAY ◆injection molding machine ◆AI(Automatic Inserting machine)... |
| M 中 | ◆SMT+ICT ◆THT+FT ◆SMT+THT ◆THT+Harness+FT ◆Assembly+FT | ◆ Genera SMD+DIP ◆ DIP parts+ Harness ◆SMD+DIP+Harness without injection molding | ◆≤0201 SMD ◆BGA,LGA,FBGA,LCC+LGA ◆Harness+injection molding ◆Conformal coating |
| S 低 | ◆纯SMT(Only SMT) ◆纯THT(Only THT) ◆纯线束(Only Harness) ◆纯组装(Only Assembly) | ◆代工代料 Material+ Assembly | ◆设计+代工代料 Design+Meterial+Assembly |
| low | higher | highest |
Technology Involved:
| Technology | Circuit | PCB/Flex/Metal PCB/Rigid-Flex | Parameter | Assembly Side | Single/Double |
| Process | SMT | Min Size | 10mm * 10mm | ||
| THT | Max Size | 410mm * 350mm | |||
| Punch | Thickness | 0.38mm ~ 6.00mm | |||
| In-circuit Test Function Test | Min Chip | 0201 chip | |||
| Glue,Burn-in Conformal Coating | Fine-pitch | 0.20mm | |||
| BGA Re-work | BGA ball size | 0.28mm |
Special Technology Involved
◆ IC Programming
◆ BGA rework
◆ Chip on Board/COB
◆ Eutectic soldering
◆ Auto-Gluing
◆ Conformal Coating
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