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Epoxy Resin with Mold Release Agent for Electrical Insulation

Epoxy Resin with Mold Release Agent for Electrical Insulation

Epoxy Resin with Mold Release Agent for Electrical Insulation
Epoxy Resin with Mold Release Agent for Electrical Insulation
Categories Electrical Epoxy Resin
Place of Origin: Shanghai, China
Brand Name: WENYOU
Model Number: LD605
MOQ: 1
Price: $3.40-3.60
CAS No.: 1675-54-3
Molecular Formula: C21H24O4
EINECS No.: 216-823-5
Main Raw Material: EPOXY
Composition: Two component resin system
Appearance: Transparent liquid
Packing Size: 20kg/pail or 220kg/drum or 1200kg/tank
Curing Method: Air fast curing
Adhesion Property: Good adhesion to surface
Release Method: Spraying, scraping, dipping
Mold Cleanliness: Reduces dirt accumulation
Defect Reduction: Reduces defective rate
Multiple Demolding: Multiple demolding cycles
Surface Preparation: Requires mold drying
Product Appearance: Improves product appearance
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Company Info.
Shanghai Wenyou Industry Co., Ltd.
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Epoxy Resin with Mold Release Agent for Electrical Insulation

Product Description
LD605 is mainly used as a release agent for epoxy resin products, especially for difficult-to-release, complex mold insulating parts, transformers, high-voltage switches, dry-type transformers, and other epoxy carbon fiber products.



Important performance:
1. Clean, colorless, oil-free, and good adhesion to the surface
2. Easy to operate
3. Will not transfer to
molded products and can improve the appearance of products
4. Air fast curing
5. Keep the mold clean for a long time to reduce the
defective rate
6. It is once again applied to multiple demolding cycles
7. Reduce the accumulation of dirt and mold surface
Specification
How to use release agent:
In order to obtain the best release effect, the surface of the mold should be dried by the cleaning agent first, and all the previously used trace release agents are cleaned, and the usual brushing methods can be used, such as spraying, scraping, dipping, and spraying. better. When the solvent is completely evaporated, it can be directly produced.

How to use release agent:
In order to obtain the best release effect, the surface of the mold should be dried by the cleaning agent first, and all the
previously used trace release agents are cleaned, and the usual brushing methods can be used, such as spraying, scraping, dipping,
and spraying. better. When the solvent is completely evaporated, it can be directly produced.
Packing & Delivery
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Product Tags:

electrical epoxy resin with mold release

  

epoxy resin for electrical insulation

  

insulating epoxy resin with release agent

  
Buy Epoxy Resin with Mold Release Agent for Electrical Insulation at wholesale prices

Epoxy Resin with Mold Release Agent for Electrical Insulation

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