Sign In | Join Free | My benadorassociates.com
benadorassociates.com
Products
Search by Category
Home > Electronics Production Machinery >

Hybrid PCB 4-layer on 20mil Rogers 4350B FR4 Material

Categories Multi Layer PCB
Brand Name: Bicheng
Model Number: BIC-332.V1.0
Certification: UL, ISO9001, IATF16949
Place of Origin: CHINA
MOQ: 1PCS
Price: USD9.99-99.99
Payment Terms: T/T
Supply Ability: 5000PCS per month
Delivery Time: 8-9 working days
Packaging Details: Vacuum bags+Cartons
Base material: Rogers RO4350B + TG170 FR-4
Layer count: 4-layer
PCB thickness: 0.98mm
PCB size: 80.22mm × 90mm
Silkscreen: White
Solder mask: Green
Copper weight: 0.5oz (0.7 mils) for inner layers; 1oz for outer layers
Surface finish: Immersion gold
  • Haven't found right suppliers
  • Our buyer assistants can help you find the most suitable, 100% reliable suppliers from China.
  • And this service is free of charge.
  • we have buyer assistants who speak English, French, Spanish......and we are ready to help you anytime!
Submit Buying Request
  • Product Details
  • Company Profile

Hybrid PCB 4-layer on 20mil Rogers 4350B FR4 Material

This 4-layer hybrid PCB is specifically engineered for high-performance electronic applications, integrating Rogers RO4350B and TG170 FR-4 materials. It leverages the superior electrical performance of RO4350B (close to PTFE/woven glass) and the reliable manufacturability of TG170 FR-4, making it ideal for multi-layer board constructions requiring stable signal transmission and excellent dimensional stability.


PCB Specification

ParameterDetails
Layer Count4-Layer (rigid structure)
Base MaterialRogers RO4350B (proprietary woven glass reinforced hydrocarbon/ceramic laminate) + TG170 FR-4
Board Dimensions80.22mm × 90mm per piece (1PCS), tolerance ±0.15mm
Minimum Trace/Space4 mils (trace) / 6 mils (space)
Minimum Hole Size0.3mm
ViasNo blind vias / buried vias; total vias: 125; via plating thickness: 20 μm
Finished Board Thickness0.98mm
Finished Copper Weight0.5oz (0.7 mils) for inner layers; 1oz for outer layers
Surface FinishImmersion gold
SilkscreenWhite on top layer; White on bottom layer
Solder MaskGreen on top layer; Green on bottom layer
Quality Assurance100% electrical testing before shipment

PCB Stack-up

Layer NameMaterialThickness
Top Layer (Copper_layer_1)Copper35 μm
Substrate Layer 1Rogers RO4350B Core0.508mm (20 mil)
Inner Layer 1 (Copper_layer_2)Copper18 μm
Bonding LayerFR-4 Prepreg0.2mm
Inner Layer 2 (Copper_layer_3)Copper18 μm
Substrate Layer 2Tg170 FR-4 Core0.102mm (4 mil)
Bottom Layer (Copper_layer_4)Copper35 μm

Rogers RO4350B Material Introduction

Rogers RO4350B materials are proprietary woven glass reinforced hydrocarbon/ceramics with electrical performance close to PTFE/woven glass and the manufacturability of epoxy/glass. RO4350B laminates provide tight control on dielectric constant (Dk) and maintain low loss while utilizing the same processing method as standard epoxy/glass. Available at a fraction of the cost of conventional microwave laminates, RO4350B laminates do not require the special through-hole treatments or handling procedures as PTFE based materials. These materials are UL 94 V-0 rated for active devices and high power RF designs.


This PCB combines RO4350B with TG170 FR-4 to further optimize the balance between performance and cost for 4-layer rigid board applications.



Key Material Features

FeatureSpecification/Description
Dielectric Constant (Dk)3.48 ± 0.05 at 10GHz/23°C (RO4350B)
Dissipation Factor0.0037 at 10GHz/23°C (RO4350B)
Thermal Conductivity0.69 W/m/°K (RO4350B)
Coefficient of Thermal Expansion (CTE)X axis: 10 ppm/°C; Y axis: 12 ppm/°C; Z axis: 32 ppm/°C (RO4350B)
Glass Transition Temperature (Tg)>280 °C (RO4350B); 170 °C (TG170 FR-4)
Water Absorption0.06% (low water absorption, RO4350B)
Flammability RatingUL 94 V-0 rated (RO4350B)
Layer Structure4-layer rigid construction with RO4350B core, TG170 FR-4 core and FR-4 prepreg
Surface FinishImmersion gold, ensuring excellent solderability and corrosion resistance
Solder Mask & SilkscreenGreen solder mask on both layers; white silkscreen on both layers, facilitating component assembly and identification

Core Benefits

Ideal for Multi-layer Board (MLB) Constructions: The combined use of RO4350B and TG170 FR-4 is well-suited for 4-layer board designs, meeting complex circuit requirements.


Cost-Effective Fabrication: Processes like FR-4 at lower fabrication cost compared to conventional microwave laminates, reducing production expenses.


Excellent Dimensional Stability: RO4350B's CTE is similar to copper, ensuring superior dimensional stability even in harsh thermal environments.


Reliable Through-Hole Quality: Low Z-axis CTE of RO4350B provides reliable plated through-hole quality, suitable for severe thermal shock applications.


Competitive Pricing: Balances high performance with cost-effectiveness, offering competitive advantages in mass production.


Stable Thermal Performance: High Tg of RO4350B ensures stable expansion characteristics over the entire circuit processing temperature range.


Quality Standard & Availability

Quality Standard: Complies with IPC-Class-2 quality standards.


Availability: Worldwide supply is supported.


Typical Applications

-Telecom Infrastructure: Cellular Base Station Antennas and Power Amplifiers


-RF Identification: RF Identification Tags


-Automotive Electronics: Automotive Radar and Sensors


-Satellite Communication: LNB's (Low Noise Blocks) for Direct Broadcast Satellites


Summary

The 4-layer rigid PCB integrating Rogers RO4350B and TG170 FR-4 materials is a high-performance and cost-effective solution tailored for multi-layer board applications. Its global availability and competitive pricing make it a trusted choice for telecom, automotive, RFID, and satellite communication projects worldwide.


Buy Hybrid PCB 4-layer on 20mil Rogers 4350B FR4 Material at wholesale prices
Send your message to this supplier
 
*From:
*To: Bicheng Electronics Technology Co., Ltd
*Subject:
*Message:
Characters Remaining: (0/3000)
 
Inquiry Cart 0