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High Reliability MEMS Gyro Chip for Robotics and Autonomous System

Categories Fiber Optic Gyro
Brand Name: Firepower
Model Number: MGZ221HC
Place of Origin: china
MOQ: 1
Price: negotiable
Payment Terms: T/T,L/C,Western Union
Supply Ability: 100 pcs/month
Delivery Time: 20 days for sample
Packaging Details: sponge+box
product name: GYRO PCB
Range: 400deg/s
Band Width: >200Hz, @3dB
Resolution: 24 bits
scale factor: 16000 lsb/deg/s, @25℃
Delay(customized): <1.5ms
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High Reliability MEMS Gyro Chip for Robotics and Autonomous System

High Reliability MEMS Gyro Chip for Robotics and Autonomous System
High-Precision MEMS Gyroscope for Inertial Measurement Unit

Our MEMS gyroscope chip delivers high-precision angular rate sensing for advanced inertial navigation and motion control applications. Designed with aerospace-level reliability and industrial-grade durability, it provides ultra-low noise, low bias instability, and excellent temperature stability for platforms that require long-term accuracy and robust performance.

Engineered for UAVs, autonomous robots, and industrial equipment, this MEMS gyro chip offers fast dynamic response, compact form factor, and low power consumption—making it ideal for embedded navigation systems and precision motion platforms.

PCB Design Guidelines
  • Decoupling capacitors for pins VCP, VREF, VBUF, and VREG should be placed as close to the pins as possible with minimized trace resistance
  • Other ends of decoupling capacitors for VREF, VBUF, and VREG should connect to nearest AVSS_LN and then to signal ground via a magnetic bead
  • Decoupling capacitors for VCC and VIO must be placed close to corresponding pins
  • VCC operation requires about 35mA current - use wide PCB traces for voltage stability
  • Avoid routing under the package for smooth assembly
  • Position components away from stress concentration areas, heat sources, and mechanical contact points
MEMS Gyroscope Chip PCB Layout Diagram showing optimal component placement and routing
Technical Specifications
PerformanceUnitMGZ318HC-A1MGZ221HC-A4MGZ330HC-O1
Rangedeg/s400400400
Band Width @3DB customizedHz200200300
Output accuracy(digital SPI)bits242424
Output rate(ODR)(customized)Hz12K12K12K
Delay(customized)ms<1.5<1.5<1
Bias stabilitydeg/hr(1o)<0.1<0.5<0.1
Bias stability (1σ 10s)deg/hr(1o)<1<5<1
Bias stability (1σ 1s)deg/hr(1o)<3<15<3
Bias error over temperature (1σ)deg/hr(1o)<10<3010
Bias temperature variations, calibrated(1σ)deg/hr(1o)<1<10<1
Bias repeatabilitydeg/hr(1o)<0.5<3<0.3
Scale factor at 25°Clsb/deg/s160001600020000
Scale factor repeatability (1σ)ppm(1o)<20ppm<20ppm<100ppm
Scale factor vs temperature (1σ)ppm(1o)<100ppm<100ppm<300ppm
Scale factor non-linearity (1σ)ppm<150ppm<150ppm<300ppm
Angular random walk(ARW)°/√h<0.05<0.25<0.05
Noise(Peak to Peak)deg/s<0.35<0.4<0.25
GValue sensitivity°/hr/g<1<3<1
Vibration rectification error(12gRMS,20-2000)°/hr/g(rms)<1<3<1
Power-on time (valid data)s750m
Sensor Resonant Frequencyhz10.5k-13.5K
Environmental Specifications
  • Impact (power on): 500g, 1ms
  • Impact resistance (power off): 10000g, 10ms
  • Vibration(power on): 18g rms (20Hz to 2kHz)
  • Working temperature: -40℃ to +85℃
  • Store temperature: -55℃ to +125℃
  • Supply voltage: 5±0.25V
  • Current consumption: 45ma
MEMS Gyroscope Chip Installation Diagram showing proper mounting and placement guidelines
Installation Guidelines

High-performance MEMS gyroscope is a high-precision test equipment. To achieve optimal design performance, consider these installation recommendations:

  • Evaluate sensor placement using thermal analysis, mechanical stress simulation (bending measurement/FEA), and impact robustness testing
  • Maintain appropriate distance from:
    • PCB thickness recommendations: 1.6-2.0mm to minimize inherent stress
    • Buttons/mechanical stress points
    • Heat sources (controllers, graphics chips) that may raise PCB temperature
  • Avoid placement in areas prone to mechanical stress, warping, or thermal expansion
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