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Double-layer 1.6mm TMM4 PCB Silver and Gold Plating

Categories RF PCB Board
Brand Name: Bicheng
Model Number: BIC-332.V1.0
Certification: UL, ISO9001, IATF16949
Place of Origin: CHINA
MOQ: 1PCS
Price: USD9.99-99.99
Payment Terms: T/T
Supply Ability: 5000PCS per month
Delivery Time: 8-9 working days
Packaging Details: Vacuum bags+Cartons
Base material: Rogers TMM4
Layer count: 2 layers
PCB thickness: 1.6mm
PCB size: 47mm x 118mm (1 piece)±0.15mm
Silkscreen: White
Solder mask: Green
Copper weight: 1oz (equivalent to 1.4 mils / 35 μm per layer)
Surface finish: Silver and Gold Plating (Gold over Silver)
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Double-layer 1.6mm TMM4 PCB Silver and Gold Plating

This high-performance 2-layer PCB is built with Rogers TMM4—a premium thermoset microwave material composed of ceramic, hydrocarbon, and thermoset polymer composite. Engineered for robust RF/microwave applications, it combines the mechanical resilience of ceramic with the process compatibility of traditional materials, eliminating the need for specialized fabrication techniques.


PCB Specification

ParameterDetails
Base MaterialRogers TMM4 (ceramic-hydrocarbon thermoset polymer composite core)
Layer Count2-layer rigid PCB
Board Dimensions47mm x 118mm (1 piece)±0.15mm
Minimum Trace/Space5/7 mils
Minimum Hole Size0.35mm
Via TypeNo blind vias (thru-hole vias only)
Finished Board Thickness1.6mm
Finished Copper Weight (Outer Layers)1oz (equivalent to 1.4 mils / 35 μm per layer)
Via Plating Thickness20 μm
Surface FinishSilver and Gold Plating (Gold over Silver) – ensures corrosion resistance, reliable soldering, and long-term contact performance
SilkscreenTop: White; Bottom: No
Solder MaskTop: Green; Bottom: No
Quality Assurance100% Electrical test prior to shipment

PCB Stack-up Details

Layer TypeMaterial/DescriptionThickness
Copper Layer 1 (Outer)Conductive copper (finished)35 μm (1oz)
Dielectric CoreRogers TMM41.524 mm (60 mils)
Copper Layer 2 (Outer)Conductive copper (finished)35 μm (1oz)


Material Overview: Rogers TMM4

Rogers TMM4 is a specialized thermoset microwave laminate designed to bridge the gap between ceramic and PTFE materials—offering strong mechanical/chemical properties without requiring specialized production techniques. Its ceramic-hydrocarbon-thermoset polymer composition delivers exceptional reliability for stripline and microstrip applications, including wire-bonding (no pad lifting or substrate deformation) and plated through-holes. Unlike traditional PTFE laminates, TMM4’s thermoset resin base ensures compatibility with all common printed wiring board (PWB) processes, simplifying fabrication while maintaining high performance for RF/microwave circuits.


Key Material Features

SpecificationValue
Material TypeCeramic-hydrocarbon thermoset polymer composite
Dielectric Constant (Dk)4.50 ± 0.045
Dissipation Factor (tanδ) @ 10 GHz0.0020
Thermal Coefficient of Dk (TCDk)15 ppm/°K
Coefficient of Thermal Expansion (CTE)X-axis: 16 ppm/°K; Y-axis: 16 ppm/°K; Z-axis: 21 ppm/°K
Decomposition Temperature (Td, TGA)425 °C
Thermal Conductivity0.7 W/mK
Moisture Absorption0.07% – 0.18%
Available Thickness Range0.0015 – 0.500 inches (±0.0015 inches)
CTE CompatibilityMatched to copper

Core Benefits

Superior Mechanical Stability: Resists creep and cold flow, ensuring long-term dimensional integrity even under stress (e.g., vibration in satellite systems).


Chemical Resistance: Withstands process chemicals used in PCB fabrication, reducing damage and improving yield rates.


Reliable Wire-Bonding: Thermoset resin base eliminates pad lifting or substrate deformation—critical for high-precision RF/microwave components.


High Plated Through-Hole Reliability: Ideal for multi-layer scalability, with consistent performance across production runs.


Standard Process Compatibility: Works with all common PWB manufacturing techniques, no specialized equipment required (lowers production complexity and cost).


Copper-Matched CTE: X/Y-axis CTE (16 ppm/°K) matches copper, minimizing thermal stress on solder joints and extending component lifespan.


Typical Applications

This PCB is optimized for high-performance RF/microwave systems requiring reliability and process flexibility, including:

-RF and Microwave Circuitry

-Power Amplifiers and Combiners

-Filters and Couplers

-Satellite Communication Systems

-Global Positioning Systems (GPS) Antennas

-Patch Antennas

-Dielectric Polarizers and Lenses

-Chip Testers


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